Murata Manufacturing Co., Ltd.

Kouichi Nitta

Hidetoshi Iwatani

Masato Fujino

Toshikazu Kato

A circuit substrate with a built-in coil has layers comprising respectively a wiring sheet, magnetic material, a flat coil, and magnetic material, which are overlaid. The wiring circuit sheet is made of polyimide, on which a circuit pattern is formed. The magnetic material is formed of a plurality of overlaid amorphous alloy sheets having slits and put together with adhesive. The flat coil may be formed by winding a copper wire covered with insulating film. The coil component, including the magnetic material and the flat coil, and the wiring circuit sheet are adhered to each other with the circuit pattern and the coil component being electrically connected to each other. According to one embodiment of the invention, the circuit substrate comprises a coil component with a flat coil and a pair of magnetic materials sandwiching the flat coil; and at least one wiring circuit sheet on which a circuit pattern is formed, the wiring circuit sheet being adhered to a surface of the coil component with the circuit pattern being electrically connected to the coil component.

Circuit substrate with a built-in coil

An electronic component comprising a generally cylindrical body having a pair of terminal caps mounted on respective opposite ends of the body. Each of the terminal caps has layers of solder material formed on inner and outer surface areas thereof. The thickness of the layer of solder material on the outer surface area of each of the terminal caps is made smaller than that on the inner surface area of the same terminal cap.

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Ohmihachiman, Japan

Kouichi Nitta