Disco Corporation

Kouichi Nehashi

Yutaka Kobayashi

Hiroshi Morikazu

Keiji Nomaru

Kentaro Odanaka

Hironari Ohkubo

Shuichiro Tsukiji

Joel Koerwer

Yasuomi Kaneuchi

Wataru Odagiri

Ryugo Oba

Takashi Sampei

Taku Iwamoto

Eri Kawagishi

A laser beam irradiation unit of laser processing apparatus includes a pulse laser beam oscillating unit, a condenser that condenses a pulse laser beam and emits the beam to a workpiece held by a chuck table, a dichroic mirror disposed between the pulse laser beam oscillating unit and the condenser, a strobe light irradiation unit that emits light to a path on which the dichroic mirror and the condenser are disposed, a beam splitter disposed between the strobe light irradiation unit and the dichroic mirror, and an imaging unit disposed on the path of light split by the beam splitter. A controller actuates the strobe light irradiation unit and the imaging unit according to the timing of the pulse laser beam, and detects the width of a laser-processed groove immediately after emission of the pulse laser beam on the basis of an image signal from the imaging unit.

Laser processing apparatus

A laser beam irradiation unit of a laser processing apparatus includes a pulse laser oscillator, a condenser which converges and irradiates a pulse laser beam upon a workpiece held on a chuck table, a dichroic mirror disposed between the pulse laser oscillator and the condenser, a strobo flash irradiation unit which irradiates light on a route of the dichroic mirror and the condenser, a beam splitter disposed between the strobo flash irradiation unit and the dichroic mirror, and an image pickup unit disposed on the route of the light split by the beam splitter. A control unit renders the strobo flash irradiation unit and the image pickup unit operative in a timed relationship with the pulse laser beam oscillated from the pulse laser beam oscillator and irradiated upon the workpiece and detects a processed state on the basis of an image signal from the image pickup unit.

A laser beam irradiation apparatus includes a laser beam oscillation unit including a pulse laser beam oscillator for oscillating a pulse laser beam and a cycle frequency setting unit for setting the cycle frequency, an acousto-optic deflection unit for deflecting the optical axis of the pulse laser beam oscillated from the laser beam oscillation section, and a control unit for controlling the acousto-optic deflection unit. The control unit outputs a driving pulse signal having a predetermined time width including a pulse width of the pulse laser beam oscillated from the pulse laser beam oscillator to the acousto-optic deflection unit based on the cycle frequency setting signal from the cycle frequency setting section.

Laser beam irradiation apparatus and laser working machine

A laser processing device capable of recognizing a failure of pulsed laser beam irradiation during a process of pulsed laser beam irradiation and taking appropriate measures. A first judgment section and a second judgment section monitor respectively whether a pulsed laser beam is actually irradiated by an oscillation of a laser oscillator at the timing when a pulse signal is output from a pulse signal output section and whether the pulse signal output section outputs the pulse signal as setting to the laser oscillator at the timing when the pulse signal is output based on the preset pulse number. When there is a failure of the pulsed laser beam irradiation during the processing, the occurrence of failure is recognized and it can be recognized whether the failure is caused by a laser beam irradiating unit or a controller including the pulse signal output section.

Laser processing device

A laser beam irradiation apparatus includes an oscillation unit, an acousto-optic deflection unit for deflecting a laser beam oscillated by the oscillation unit, a condenser for condensing the deflected laser beam, and a control unit. The control unit determines an actual output power of the laser beam based on a light reception signal received from laser beam output detection means in response to a control signal for controlling a deflection angle adjustment unit of the deflection unit. Then, the control unit arithmetically operates the ratio of an actual output power corresponding to the control signal with reference to the lowest value of the actual output power. Further, the control unit arithmetically operates a correction value corresponding to the ratio of the actual output power to produce a control map and controls the output adjustment unit based on the control map.

A via hole depth detector for detecting the depth of a via hole formed in a workpiece held on a chuck table, comprising: a first surface position detection means which comprises a first detection laser beam oscillation means for oscillating a first detection laser beam having a predetermined wavelength and detects the height position of an illuminated portion of the workpiece based on the reflected light of the first detection laser beam; a second surface position detection means which comprises a second detection laser beam oscillation means for oscillating a second detection laser beam having a wavelength different from the wavelength of the first detection laser beam and detects the height position of an illuminated portion of the workpiece based on the reflected light of the second detection laser beam; and a control means for obtaining the depth of the via hole formed in the workpiece based on a detection value obtained by the first surface position detection means and a detection value obtained by the second surface position detection means.

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Tokyo, Japan

Kouichi Nehashi