Fujitsu Semiconductor Limited

Fujitsu Microelectronics Limited

Kouichi Nakamura

Takao Nishimura

Akira Takashima

Yoshikazu Kumagaya

Kazuyuki Aiba

A semiconductor device includes a semiconductor element having a main surface where an outside connection terminal pad is provided. The semiconductor element is connected to a conductive layer on a supporting board via a plurality of convex-shaped outside connection terminals provided on the outside connection terminal pad and a connection member; and the connection member commonly covers the convex-shaped outside connection terminals.

Semiconductor device

A relay board provided in a semiconductor device includes a first terminal, and a plurality of second terminals connecting to the first terminal by a wiring. The wiring connecting to the first terminal is split on the way so that the wiring connects to each of the second terminals.

Relay board and semiconductor device having the relay board

The present invention provides a method for manufacturing a semiconductor device which includes at least supplying an adhesive for bonding an electronic component which has a plurality of bumps with a substrate which has a plurality of bonding pads corresponding to the bumps, to at least a portion of the substrate, between the electronic component and the substrate, flow-casting the adhesive on the substrate by a flow-casting unit, in such a manner that the expression S/S&#x3e;1 is satisfied, where Sis the total contact surface area with the substrate of the adhesive supplied to the substrate, and Sis the total contact surface area with the substrate of the adhesive after the flow-casting, and curing the adhesive while making the adhesive contact with the electronic component and the substrate in a state where the bumps are abutted against the bonding pads.

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Kawasaki, Japan

Kouichi Nakamura