Hitachi Chemical Company, Ltd.

Kouichi Nagao

Hiroshi Nomura

Junichi Imaizumi

Masakatsu Suzuki

Eikichi Satou

Koushi Sakairi

Yasushi Katoh

Takato Oti

A flexible printed-circuit board covered with a coverlay is produced by bonding (a) a flexible printed-circuit board that comprises a flexible base having a surface bearing a circuit and (b) a polyimide film having a surface treated to increase adhering property and another surface not treated to increase adhering property, each of the surfaces being coated with an adhesive layer, with the adhesive layer on the surface treated to increase adhering property interposed between the polyimide film and the surface bearing the circuit, and then peeling off the adhesive layer coating the polyimide film on the surface not treated to increase adhering property.

Method of producing flexible printed-circuit board covered with coverlay

A heat resistant adhesive composition comprising a specific polyamic acid solution and a bis-maleimide compound exhibits flexibility and excellent heat resistance after bonding two material bodies, and therefore, it can be suitably used for producing of flexible metal-clad laminates, double-sided flexible metal-clad laminates, and multilayer printed circuit boards, and for attaching coverlay films to printed circuit boards.

Heat resistant adhesive composition and bonding method using the same

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Shimodate, Japan

Kouichi Nagao