Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Kouichi Nagao

Nozomi Shimoishizaka

Yoshifumi Nakamura

Hiroyuki Imamura

Takayuki Tanaka

Michinari Tetani

Michiharu Torii

Hiroaki Fujimoto

Kazunari Nishihara

Tomohiro Tamaki

Nobuyuki Koutani

A semiconductor device including a semiconductor elementhaving an active element region, a plurality of element electrodesformed on a principal face of the semiconductor element, external terminalsandconnected to one or more element electrodes via connection membersand, one or more first heat-dissipation protrusionsformed on the principal face of the semiconductor element, an insulation resin layercovering the principal face of the semiconductor element and the first heat-dissipation protrusions, and a heat-dissipation mediumcontacting a face of the insulation resin layer on a side opposite to a side contacting front faces of the first heat-dissipation protrusions. At least a part of the active element region is included in a region below a bottom face of the first heat-dissipation protrusion, the first heat-dissipation protrusion is not connected to the external terminal within the active element region, a thermal conductivity of the first heat-dissipation protrusion is larger than a thermal conductivity of the insulation resin layer, and a thickness of the insulation resin layer from the front face of the first heat-dissipation protrusion to the heat-dissipation medium is thinner than a thickness of the insulation resin layer from the principal face of the semiconductor element to the heat-dissipation medium. Thereby, it is possible to improve the speed of dissipating heat from the active element region of the mounted semiconductor element to the heat-dissipation medium.

Wiring board, semiconductor device and method for manufacturing the same

A wiring board includes: a flexible insulating base; a plurality of conductive wirings arranged on the insulating base, end portions of the conductive wirings defining inner leads at a region where a semiconductor chip is to be mounted; and bump electrodes that are provided respectively at the inner leads of the conductive wirings. The wiring board further includes: dummy inner leads having a shape and a pitch corresponding to a shape and a pitch of the inner leads and aligned with the inner leads, the dummy inner leads being provided with dummy bump electrodes corresponding to the bump electrodes; a trunk conductive wiring provided for a group of one or an adjacent plurality of the dummy inner leads; and a branch wiring branching off from the trunk conductive wiring, the branch wiring being connected with the dummy inner leads belonging to the group corresponding to the trunk conductive wiring. Stress concentration on the inner leads during packaging of the semiconductor chip, resulting from the sparse arrangement of the electrode pads of the semiconductor chip, can be alleviated, thus suppressing a break in the inner leads.

Wiring board and semiconductor device using the same

A wiring board according to the present invention includes: an insulating base; a plurality of first conductor wiringsaligned in an inner region on the insulating base; bumpsformed on the respective first conductor wirings; and a protective filmthat is formed on the insulating base so as to cover the first conductor wirings and has an opening region through which the bumps are exposed. The height of at least part of a surface of the protective film from a surface of the insulating base is greater than the height of the bumps from the surface of the insulating base. With this configuration, it is possible to decrease the thickness in the state where a protective tape is placed on the wiring board to protect bumps, thereby increasing the length of the wiring board that can be held by a reel for supplying the wiring board.

Wiring board with a protective film greater in heights than bumps

A flexible insulating base, a plurality of conductor wirings aligned on the flexible insulating base, and bump electrodes provided respectively in end portions of the plurality of conductor wirings in a region where a semiconductor chip is to be placed are provided. The semiconductor chip is mounted on the conductor wirings by bonding electrode pads formed on the semiconductor chip to the bump electrodes. An auxiliary conductor wiring formed similarly to the conductor wirings is provided on the insulating base, and an auxiliary bump electrode formed similarly to the bump electrodes is provided on the auxiliary conductor wiring, so that the electrode pads formed on the semiconductor chip can be registered with respect to the bump electrodes on the conductor wirings by positioning the semiconductor chip with reference to the auxiliary bump electrode. It is possible to configure a wiring board having register marks capable of positioning electrode pads of a semiconductor chip with respect to bump electrodes with high accuracy.

Wiring board

A wiring board includes first and second feeding electrodes () provided along both sides of an insulating substrate (), feeding bus lines () extending in a traverse direction and connected to both the feeding electrodes, and conductor wirings () having one side terminals forming inner leads having protruding electrodes () and the other side terminals connected to the feeding bus lines. The inner leads in each unit region are arranged in two lines extending in the traverse direction. The inner leads of a first group are arranged with a dense wiring pitch, and the inner leads of a second group include a dense pitch region in which a wiring pitch is the same as that of the inner leads of the first group, and a sparse pitch region in which a wiring pitch is longer than that of the inner leads of the first group. The inner leads () of the first group and the inner leads () in the dense pitch region of the second group are connected to the feeding bus line on one side of each region, and the inner leads () in the sparse pitch region of the second group are connected to the feeding bus line on the other side of each unit region. Non-uniformity of heights of the protruding electrodes due to a difference in the wiring pitches of the inner leads can be suppressed easily.

Wiring board and method for producing the same

A wiring board includes: a flexible insulating base; a plurality of conductive wiringsarranged on the flexible insulating base; protruding electrodesprovided respectively at an end portion of the same side of each of the conductive wirings; external terminalsformed respectively at the other end portions of each of the conductive wirings; metal plating layers applied on the conductive wirings, the protruding electrodes and the external terminals; and solder resist layersformed respectively by coating the conductive wirings in regions between the end portions at which the protruding electrodes are provided and the external terminals. In the regions where the solder resist layers are formed, no metal plating layers are formed on the conductive wirings, and the surfaces of the conductive wirings to be contacted with the flexible insulating base are rougher than the surfaces not to be contacted with the flexible insulating base. Even when a film base is thin, bending stress applied to the conductive wirings is relieved sufficiently, and thus breaks in the wirings are suppressed.

Wiring board, semiconductor device and display module

A flexible wiring board is constructed by placing, on a surface of a flexible ultraviolet-transmissive base member in the form of a layer, a conductive member in the form of a layer and a covering member in the form of a layer. The conductive member has an exposed leading area not covered with the covering member. A lead is aligned with an electrode and they are connected together with pressure exerted by a pressure applying jig which is ultraviolet-transmissive. A photosetting adhesive resin capable of shrinking in volume is injected between the flexible wiring board and a printed circuit board. The photosetting adhesive resin is irradiated with ultraviolet passing through the pressure applying jig and the base member. When irradiated with the ultraviolet rays, the photosetting adhesive resin hardens. Volume shrinkage force exerted by the photosetting adhesive resin enhances the connection between the lead and the electrode. Such a connecting procedure can be performed at room temperature thereby cutting down the cost of the flexible board and providing a wider range of applications thereof.

Growing community of inventors

Kyoto, Japan

Kouichi Nagao