Chisso Corporation

Piolax, Inc.

Hitachi, Ltd.

Kanto Auto Works, Ltd.

Kouichi Katou

Kouichi Kunimune

Eiji Watanabe

Hirotoshi Maeda

Shigeo Okada

Toshihiko Ookawara

Shirou Hujimori

Noboru Niikura

A lock apparatus includes a operation handle, a pair of springs movably supported by the container member, a pair of slide pins urged in directions of lock holes defined on the support member by the springs, respectively, and a pair of cam members to which rear end portions of the slide pins are fitted, respectively, to urge each slide pin to project and retract. When the operation handle is operated in a swing manner, a front end portion of each slide pin is retracted from each lock hole of the support member against pressure of each spring. Engagement holes are defined on opposed surfaces of each front end portion of the cam member having a cylindrical shape. Each rear end portion of the slide pin is formed in a bifurcated structure to have elastic pieces. Each of elastic pieces has a protrusion for detachably engaging with each of engagement holes.

Lock apparatus

A clamp is provided having a synthetic clip and a metal plate spring. The clip includes a pair of side walls opposed each other at a certain distance, engaging shoulder portions each formed at an outer surface of each of the side walls and configured to be engaged with a peripheral edge of a mounting hole of a panel at the time of securing a mounting member to the panel. The spring is attached to one of the side walls of the clip. A press-fitting portion is formed at an inner surface of the other side wall and configured to be pressed against a boss portion of the mounting member. The spring includes a bite-into portion facing the press-fitting portion and configured to bite into the boss portion of the mounting member at the time of securing the mounting member to the panel.

Clamp

Photosensitive polymide precursor resin composition

Photosensitive polyimide resin composition

A photosensitive resin composition containing 0.5 to 15 parts by weight of a compound generating an acid by light irradiation in 100 parts by weight of a polyamic acid amide having an alkoxysilane having a specified structure at its terminals are provided,

Photosensitive polyimide precursor composition with photoacid generator

The present invention provides a silicon-containing polyamic acid derivative which is represented by the formula (VI) ##STR1## and which has a logarithmic viscosity number of 0.1 to 5.0 dl/g at 30.degree. C. in N-methyl-2-pyrrolidone, said silicon-containing polyamic acid derivative being obtained by reacting A mol of a tetracarboxylic acid derivative, B mol of a diamine, and C mol of an aminosilicon compound so as to meet the relations of the equations (IV) and (V): ##EQU1## A photosensitive resin composition using this silicon-containing polyamic acid derivative can be easily manufactured, permits the formation of a negative type sharp relief pattern, can inhibit film reduction at the time of curing by baking, and is excellent in adhesive properties to substrates, heat stability and shelf stability.

Silicon-containing polyamic acid derivative and photosensitive resin

A photosensitive polyimide precursor composition of the present invention comprises a polyimide precursor represented by the formula (6)

Photosensitive polyimide precursor composition

Method of preparing a negative pattern utilizing photosensitive polymer

Printer for a point-of-sales system

Growing community of inventors

Yokohama, Japan

Kouichi Katou