Mitsubishi Electric Corporation

Kouichi In

Tetsuo Takahashi

Kenji Harada

Masayoshi Tarutani

Kazuhiko Sakutani

Masao Takata

There is provided a semiconductor device having a structure that can suppress occurrence of chipping in a device region and that can reduce manufacturing cost of the semiconductor device. A semiconductor device includes a substrate and a first amorphous insulating film. The substrate has a main surface and an end surface. The main surface includes a peripheral region and a device region. The first amorphous insulating film is disposed on the peripheral region, and is separated from the device region. The first amorphous insulating film extends along the end surface in the form of a stripe. The first amorphous insulating film is flush with the end surface.

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Tamba, Japan

Kouichi In