Nitto-Denko Corporation

Kouichi Hashimoto

Takahiro Fukuoka

Yoshio Nakagawa

Tatsuya Kubozono

Kazuhiko Yamamoto

Eiji Toyoda

Fumiteru Asai

Makoto Namikawa

Seiichiro Shirai

Shouji Yamamoto

Koji Akazawa

Kouji Akazawa

Akiyoshi Yamamoto

Toshio Shintani

An adhesive sheet for processing semiconductor substrates comprises a UV rays- and/or radiation-transmittable base film and an adhesive layer that undergoes a polymerization curing reaction by means of UV rays and/or radiation, wherein the adhesive layer is formed using a multifunctional acrylate oligomer and/or monomer having a double bond, and is blended so as to result in 1 double bond per total average molecular weight of 225 to 8000 as determined on the basis of the weight average molecular weight of the multifunctional acrylate oligomer and/or monomer.

Adhesive sheet for processing semiconductor substrates

A curable re-release adhesive which, when subjected to a curing reaction caused by irradiation with radiation, shows a sufficient drop of adhesion and causes the adherend to be warped to a minimized extent as developed by the shrinkage force caused by the curing reaction. The re-release adhesive contains a radiation-reactive polymer including a main chain and a plurality of intramolecular side chains, each such side chain having a terminal carbon-carbon double bond, a chain length of 6 or more in terms of number of atoms, and the same or a different number of atoms as each other side chain in the polymer. The release adhesive shows a shrinkage force of 30 MPa or less as developed by a curing reaction upon irradiation. A re-release adhesive sheet is also disclosed, including a substrate film and an adhesive layer containing the re-release adhesive, provided on one surface thereof.

Re-release adhesive and re-release adhesive sheet

An adhesive film in roll for wafer processing is constituted by laminated multiple layers including a base film, a radiation curing type adhesive layer, and a releasing film in this sequence, in which the arithmetic average roughness (Ra) of the side of the base film and/or releasing film opposite to the radiation curing type adhesive layer is 1 &#x3bc;m or more, and the weight of the radical polymerization initiator contained in the radiation curing type adhesive layer is less than 1000 ppm.

Adhesive sheet roll for wafer processing

The present invention is intended to collectively remove unnecessary resist material and side wall protective film after dry etching by side wall protection process, making it possible to simplify the process for the preparation of semiconductors, etc. The process according to the present invention comprises removing unnecessary resist material ( ) left behind after dry etching by side wall protection process with a resist pattern ( ) present on a semiconductor substrate ( ) as a mask and side wall protective film ( ) deposited on the side wall ( ) of pattern, said process comprising the steps of applying an pressure-sensitive adhesive sheet ( ) to said substrate ( ), heating the pressure-sensitive adhesive layer ( ) under pressure so that the pressure-sensitive adhesive ( ) comes in contact with up to the side wall ( ) of pattern, and then collectively peeling said pressure-sensitive adhesive sheet ( ), said resist material ( ) and said side wall protective film ( ) off said substrate.

Process for the collective removal of resist material and side wall protective film

Ultraviolet curing pressure-sensitive adhesive sheet

Growing community of inventors

Ibaraki, Japan

Kouichi Hashimoto