Fuji Electric Co., Ltd.

Kouichi Haraguchi

Yuji Ichimura

A resin sealed semiconductor device includes a metallic base plate and a covering case adhered to a peripheral section of the metallic base plate. Semiconductor elements are loaded on the metallic base plate, and lead-out terminals extend from an upper surface of a terminal-supporting plate made to adhere to lead-out terminals. The terminal-supporting plate forms an upper surface of the covering case 5 which is filled with a sealing resin. Uneven stripes are molded and extend circumferentially over the entire outer peripheral surface of terminal-supporting plate to roughen the peripheral surface, and the adhesion strength is reinforced by increasing the adhesive area between the terminal-supporting plate and the sealing resin.

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Matsumoto, Japan

Kouichi Haraguchi