Toray Industries, Inc.

Kouichi Dan

Seiichiro Murase

Mitsuhito Suwa

Jun Sakamoto

Hiroji Kojima

Hiroji Shimizu

Takahiro Motoshiromizu

Mayumi Matsumoto

Tomonori Kawakami

Sachio Inaba

Ken Suzuki

A polyester resin composition including an ionic liquid that can dissolve an acid component monomer and/or oligomers of a polyester terephthalate, and a copper element that exhibits a reduced amount of production of the acid component monomer and/or oligomers of the polyester. Examples of the ionic liquid include 1-butyl-3-methylimidazolium acetate, 1-butyl-3-methylimidazolium chloride and tetrabutyl ammonium bromide. In one polyester resin composition, the surface roughness Ra of a capture plate is less than 0.150 &#x3bc;m, as measured when a sample of the polyester resin composition is melt at 300&#xb0; C. for 60 minutes under a nitrogen atmosphere, quickly cooled and thermally treated at 220&#xb0; C. for 8 hours to form scattered products which are then attached to the capture plate and a gelation ratio after a 6-hour melting treatment at 300&#xb0; C. under an atmosphere with an oxygen concentration of 1% is 5% or less.

Polyester resin composition and production method thereof

An impurity-diffusing composition including (A) a polysiloxane represented by Formula (1) and (B) an impurity diffusion component.  In the formula, Rrepresents an aryl group having 6 to 15 carbon atoms, and a plurality of Rmay be the same or different. Rrepresents any of a hydroxyl group, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an acyl group having 2 to 6 carbon atoms, and an aryl group having 6 to 15 carbon atoms, and a plurality of Rmay be the same or different. Rand Reach represent any of a hydroxyl group, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, and an acyl group having 2 to 6 carbon atoms, and a plurality of Rand a plurality of Reach may be the same or different. The ratio of n:m is 95:5 to 25:75.

Impurity-diffusing composition and method for producing semiconductor element

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Mishima, Japan

Kouichi Dan