Semiconductor Energy Laboratory Co., Ltd.

Kouhei Wada

Shunpei Yamazaki

Shigenori Hayashi

Naoki Hirose

Noriya Ishida

Kazuo Urata

Shinji Imatou

Mitsunori Tsuchiya

Itaru Koyama

Mari Sasaki

An electronic device comprising a substrate having a frame, a metal lead and an electronic parts in a bonding structure, and a molding of an organic resin formed on the substrate, wherein the surface of the organic resin is provided with a hardened water-resistant or carbonaceous film or wherein pores at the surface of the organic resin are filled within an inactive gas such as argon because of a plasma treatment of the resin surface with the inactive gas whereby impurities are prevented from entering into the organic resin through the pores.

Electronic device and its manufacturing method

Electronic device including a densified region

An electronic device comprising a substrate having a frame, a metal lead and electronic parts in a bonding structure, and a molding of an organic resin formed on the substrate, wherein the surface of the organic resin is provided with a hardened water-resistant or carbonaceous film.

Plasma processing method for improving a package of a semiconductor

Growing community of inventors

Atsugi, Japan

Kouhei Wada