Nippon Steel Chemical Co., Ltd.

Kouhei Tomari

Yasuji Shichijo

Masanao Kawabe

Isamu Akiba

Hiroyuki Yano

Disclosed is a volume phase hologram recording material characterized by excellent photosensitivity, low cure shrinkage, high transparency, and particularly good storage stability and also disclosed is a recording medium prepared therefrom. Further disclosed is a photosensitive resin composition for volume phase hologram recording that comprises a soluble aromatic copolymer (A), a photoradically polymerizable compound (B) capable of copolymerizing with the soluble aromatic copolymer (A), a photopolymerization initiator (C), and a polymer binder (D). The soluble aromatic copolymer (A) has a structural unit of a divinyl aromatic compound and a structural unit of a monovinyl aromatic compound, comprises 10 to 90 mol % of a structural unit represented by the following formula (a1), has a hydroxyl equivalent of 100 to 30,000 g/equiv, a number average molecular weight (M) of 400 to 30,000, and a molecular weight distribution (M/M) of 10 or less, and accounts for 5 to 60 wt % of the composition.

Photosensitive resin composition for volume phase hologram recording and optical information recording medium using the same

The present invention relates to a volume phase hologram recording material excellent in transparency, sensitivity, low curing shrinkage, and transparency, a volume phase hologram recording medium, and a volume phase hologram. A photosensitive resin composition for volume phase hologram recording contains a low-molecular-weight solvent-soluble aromatic copolymer (A) having a structural unit of a divinyl aromatic compound and a structural unit of a monovinyl aromatic compound, a photoradical polymerizable compound (B) which is copolymerizable with the soluble aromatic copolymer (A), and a photopolymerization initiator (C) as essential components. The photosensitive resin composition further contains, one kind or more of a polymer binder (D) and a plasticizer (E), and the soluble aromatic copolymer (A) is incorporated in an amount of 5 to 60% by weight.

Provided is curable resin composition which gives a cured article excellent in chemical resistance, dielectric properties, low water-absorption, heat resistance, flame retardance, and mechanical properties and which is usable in applications such as dielectric materials, insulating materials, heat-resistant materials, and structural materials. The curable resin composition includes a component (A) which is a polyphenylene ether oligomer having a number-average molecular weight of 700 to 4,000 and having a vinyl group at both end and a component (B) which is a solvent-soluble polyfunctional vinylaromatic copolymer which has structural units derived from monomers including a divinylaromatic compound (a) and an ethylvinylaromatic compound (b) and in which the content of repeating units derived from the divinylaromatic compound (a) is 20 mol % or higher, the ratio of the amount (wt. %) of the component (A) to that (wt. %) of the component (B) being (20 to 98):(2 to 80). The composition can further contain a layered silicate, a halogenated flame retardant, etc.

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Fukuoka, Japan

Kouhei Tomari