Hitachi Chemical Company, Ltd.

Kouhei Taniguchi

Michio Mashino

Takayuki Matsuzaki

Tatsuya Sakuta

Shinya Katou

Kouji Komorida

Rie Katou

Flap in an adhesive tape for semiconductor manufacturing

In a wafer processing tape, circular or tongue-shaped notched parts facing the center of an adhesive layer, as seen in a plan view, are formed so as to correspond to a pasting region to a wafer ring to a depth that reaches a release substrate from the side of a base material film. Due to the formation of the notched parts, when a peeling force acts on the wafer processing tape, portions of a tacky material layer and the base material film which are more outward than the notched parts are peeled off first, and a portion that is more inward than the notched parts remains on the wafer ring in a protruding state. Accordingly, a peeling strength between the wafer processing tape and the wafer ring can be increased and the wafer processing tape can be suppressed from being peeled off from the wafer ring during processes.

Tape for processing wafer, method for manufacturing tape for processing

Tape for processing wafer, method for manufacturing tape for processing wafer, and method for manufacturing semiconductor device

In a wafer processing tape, circular or tongue-shaped notched parts facing the center of an adhesive layer, as seen in a plan view, are formed so as to correspond to a pasting region to a wafer ring to a depth that reaches a release base material from the side of a base material film. Due to the formation of the notched parts, when a peeling force acts on the wafer processing tape, portions of a tacky material layer and the base material film which are more outward than the notched parts are peeled off first, and a portion that is more inward than the notched parts remains on the wafer ring in a protruding state. Accordingly, a peeling strength between the wafer processing tape and the wafer ring can be increased. Methods of manufacturing the tape and a semiconductor device are also provided.

Wafer processing tape, method of manufacturing wafer processing tape, and method of manufacturing semiconductor device

Adhesive tape for semiconductor manufacturing

Growing community of inventors

Ichihara, Japan

Kouhei Taniguchi