Sumitomo Electric Printed Circuits, Inc.

Sumitomo Electric Industries, Limited

Kou Noguchi

Hiroshi Ueda

Kenji Takahashi

Koji Nitta

Shoichiro Sakai

Yuichi Nakamura

Masanao Yamashita

Yukie Tsuda

Kousuke Miura

Masaki Miyabara

A printed wiring board includes: a base film having a main surface; a wiring disposed on the main surface; a first plating lead connected to a first position of the wiring; and a second plating lead connected to a second position of the wiring. A cross sectional area of the wiring at a third position of the wiring is 95% or more of a cross sectional area of the wiring at the first position, the third position being an intermediate position between the first position and the second position.

Printed wiring board

A flexible printed circuit board according to the present disclosures includes a base film having an insulating property and a planar coil disposed on a surface of the base film, wherein a number of turns on an outside of a center point of a coil width of the planar coil in a plan view is greater than a number of turns on an inside of the center point.

Flexible printed circuit board and image stabilization module

A printed wiring board includes: a base film having a main surface; a wiring disposed on the main surface; and at least one plating lead disposed on the main surface and connected to the wiring.

A printed wiring board includes: a board having a through-hole; a land portion that is disposed on an inner circumferential surface of the through-hole and on a surface of the board at a circumferential edge of the through-hole, and that has a through-hole conductor portion; and a wire that is disposed on the surface of the board and that has one longitudinal end portion electrically connected to the land portion, a maximum length of a connection portion between the wire and the land portion being greater than or equal to a sum of a maximum diameter of the through-hole and a minimum line width of the wire.

A flexible printed circuit board according to the present disclosures includes a base film having an insulating property, and a planar coil disposed on a surface of the base film, wherein a number of turns on an inside of a center point of a coil width of the planar coil in a plan view is greater than a number of turns on an outside of the center point.

A method for manufacturing a printed circuit board according to one embodiment of the present invention includes a step of forming a resist pattern, and a step of forming a conductive pattern by using the resist pattern. The resist pattern has an acute angle portion in which an outer edge of a resist is bent to form an acute angle in a plan view. In a corner portion of the acute angle portion, an outer-side outer edge of the resist is rounded, and a radius of curvature of the outer-side outer edge is more than or equal to a distance from the outer-side outer edge to another outer edge adjacent thereto in a direction away from a center of curvature of the outer-side outer edge.

Method for manufacturing printed circuit board

According to an aspect of the present disclosures, a method of making a flexible printed circuit board, which includes a base film having an insulating property, a conductive pattern disposed on either one or both surfaces of the base film, and a cover layer covering a conductive-pattern side of a laminated structure inclusive of the base film and the conductive pattern, includes a superimposing step of superimposing a cover film on the conductive-pattern side of the laminated structure, the cover film having a first resin layer and a second resin layer that is laminated to an inner side of the first resin layer and that softens at a lower temperature than does the first resin layer, and a pressure bonding step of vacuum bagging the laminated structure and the cover film at a temperature higher than a softening temperature of the second resin layer.

Method of making flexible printed circuit board and flexible printed circuit board

A flexible printed circuit board according to an embodiment of the present invention includes an insulative base film; and a conductive pattern provided on at least one surface of the base film and including a wiring line including a bent portion having an angle of greater than or equal to 60&#xb0; or a branched portion having an angle of greater than or equal to 60&#xb0; in plan view. The wiring line is provided with a relaxation structure that relaxes stress concentration at the bent portion or the branched portion. The relaxation structure is structured such that the wiring line constitutes a wide wiring line or a dense wiring line group in a region in which a distance from the bent portion or the branched portion is less than or equal to 5 times a minimum width of the wiring line. The wide wiring line has a wiring line width that is greater than or equal to twice the minimum width of the wiring line. A ratio of a wiring line width to a wiring line interval of the dense wiring line group is greater than or equal to 1.5, and a total width of the dense wiring line group is greater than or equal to twice the minimum width of the wiring line.

Growing community of inventors

Koka, Japan

Kou Noguchi