Ulvac, Inc.

Kou Fuwa

Kyuzo Nakamura

Junpei Yuyama

Mitsuru Yahagi

Masao Murata

Ken Maehira

Takahiro Miyata

Ai Tanaka

Tooru Okuno

Susumu Sakio

Atsushi Kira

Providing a technique for suppressing dust generation at the time of attraction and detachment of an object to be attracted, and for enabling control the attraction force of the attraction device to be uniform. The attraction device of the present invention includes a main body part having attraction electrodes within a dielectric; and an attraction part for attracting a substrate, provided on a surface of the main body part at an attraction-side. The attraction part includes a contact support part that is in contact with, and supports the substrate and a non-contact part that is not in contact with the substrate. In the attraction part, the volume resistivity of the material of the contact support part is greater than the volume resistivity of the material of the non-contact part.

Attraction device, method for producing attraction device, and vacuum processing device

A coated film with no observable streak is formed. The landing positions of a first discharge liquid discharged through a first printing head and the landing positions of a second discharge liquid discharged through a second printing head are disposed in a mixed manner in an area on a substrate where the first printing head and the second printing head overlap. Which discharge liquids are to be landed is determined according to random numbers. Since a coated film which is formed with the first and second discharge liquids in a mixed manner is disposed between a coated film formed with the first discharge liquids and a coated film formed with the second discharge liquids, a boundary is obscured and no streak appears.

Coated film forming method

Growing community of inventors

Chigasaki, Japan

Kou Fuwa