Kinseki Limited

Mitsubishi Electric Corporation

Kotaro Yajima

Hiroshi Mitsuyama

Naokazu Terai

A semiconductor package and a semiconductor light-emitting device including the semiconductor package. The semiconductor package includes: a frame for mounting a semiconductor light-emitting element; and a lead integral with the frame. The frame and the lead are made of a resin. A metal film is located in a predetermined area on the frame.

Resin and metal semiconductor device package and semiconductor light-emitting device incorporating the package

According to this invention, an SAW electric part includes an SAW filter and an SAW oscillator formed on a substrate having the same temperature characteristics as those of a substrate on which the SAW filter is formed. A frequency converter includes the SAW electric part, a second local oscillation circuit, a frequency converter, a first mixer, and a second mixer. The second local oscillation circuit oscillates a second local oscillation signal using the SAW oscillator. The frequency converter converts a frequency of the second local oscillation signal to generate a first local oscillation signal. The first mixer mixes the first local oscillation signal with an input signal to output a composite signal to the SAW filter. The second mixer mixes an output from the SAW filter with the second local oscillation signal to output a frequency conversion signal.

SAW electric part and frequency conversion circuit

A band-pass filter includes a first filter, a second filter, and switching elements. The first filter is constituted by a plurality of filter elements. The second filter is constituted by a plurality of filter means and connected in series with the first filter. The switching elements can short-circuit either one of the first and second filters.

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Tokyo, Japan

Kotaro Yajima