Mitsubishi Materials Corporation

Kotaro Masuyama

Kazuhiko Yamasaki

Masayuki Ishikawa

Kiyotaka Nakaya

Takuma Katase

Tomohiko Yamaguchi

Kohei Otogawa

Tatsuya Numa

Tsukasa Yasoshima

Provided is a bonding sheet using a copper particle that is less prone to deteriorate the sintering property due to oxidation of the copper particle, and can form a dense bonding layer having fewer voids, and can also bond an electronic component and the like with a high bonding strength. A bonding sheet () contains a copper particle () and a solvent () having a boiling point of 150° C. or higher, in which the copper particle () has a surface covered with an organic protective film, the content ratio of the copper particle () to the solvent () is in the range of 99:1 to 90:10 by mass, and the BET diameter of the copper particle () is in the range of 50 nm to 300 nm both inclusive.

Bonding sheet

A silver powder is produced by reducing silver carboxylate and a particle size distribution of primary particles comprises a first peak of a particle size in a range of 20 nm to 70 nm and a second peak of a particle size in a range of 200 nm to 500 nm, organic matters are decomposed in an extent of 50 mass % or more at 150&#xb0; C., gases generated in heating at 100&#xb0; C. are: gaseous carbon dioxide; evaporated acetone; and evaporated water.

Silver powder, paste composition, and method of producing silver powder

The invention provides a power module substrate with a heat sink, which includes a power module substrate provided with an insulating substrate, a circuit layer provided on one surface of the insulating substrate and a metal layer provided on the other surface of the insulating substrate. The heat sink is bonded to the power module substrate via a bonding layer () to a surface on an opposite side to the insulating substrate of the metal layer. Bonding layer is a sintered body of silver particles, a porous body having a relative density in a range of 60% or more and 90% or less, and having a thickness in a range of 10 &#x3bc;m or more and 500 &#x3bc;m or less.

Heat sink-equipped power module substrate and manufacturing method for heat sink-equipped power module substrate

Growing community of inventors

Ushiku, Japan

Kotaro Masuyama