Tdk Corporation

Tokyo Denki Kagaku Kogyo Kabushiki Kaisha

Kogyo Kabushiki Kaisha

Tokyo Denki Kagaku

Tokyo Denki Kogaku Kogyo Kabushiki Kaisha

Kotaro Harigane

Tetsuro Ito

Kenichi Takahashi

Hirokazu Shudo

Yoshinobu Taguchi

Shuichi Tando

Tetsuo Takahashi

Akihiro Kato

Hiroshi Yagi

Hisashi Fujita

Keiichi Ihara

Kenji Fujita

Atsushi Shindo

Hiroaki Honda

Hiroyuki Ohira

Tomokazu Takahashi

An electronic component or chip mounting apparatus capable of carrying out a chip mounting operation at a high speed and with high accuracy. The apparatus includes two transition stations, a chip extracting head reciprocating between a chip feed section and the transition stations and two chip depositing heads arranged for reciprocating between the transition stations and a substrate on which a chip is to be mounted, so that a chip mounting operation may be carried out according to a reciprocating relay system and an operation of depositing the chip on the substrate may take place with high efficiency.

Electronic component mounting apparatus

An apparatus for automatically mounting an electronic device having a plurality of leads on a printed circuit board, by inserting the leads into mount holes of the printed circuit board. A plurality of extension pins are connected straight to the leads to hold the leads of the electronic device. The extension pins are inserted into the mount holes, while the connection between the extension pins and the leads is maintained. The extension pins are then removed from an opposite side of the printed circuit board, thus guiding and inserting the tips of the leads into the mount holes.

Apparatus for mounting electronic device on a printed circuit board

An apparatus for automatically mounting chip-type circuit elements on a substrate for a printed circuit board is disclosed which is capable of overcoming the problem of suction failure and wrong posture of a circuit element to efficiently carry out the mounting operation of the elements on a substrate. The automatic mounting apparatus includes a detecting device for detecting a defect such as a failure in suction of a circuit element by a mounting head and/or the wrong posture of a circuit element sucked up and a rotating disk controllably actuated to allow a mounting head other than that relating to the defect to suck up a circuit element of the same kind from tape feeders and mount it on the substrate after the detecting device detects the defect.

Apparatus for automatically mounting chip-type circuit elements on

An electronic component selection and supply apparatus for use in an automatic electronic component inserting machine for automatically inserting electronic components of irregular shapes which are unsuitable for taping, such as electrolytic capacitors, power transistors and variable resistors, into a printed circuit board includes selection and supply apparatus for selecting an electronic component at a first position and supplying the selected component to a second position, the apparatus including electronic component sequence apparatus for selecting a predetermined electronic component which includes a device for vertically holding a plurality of electronic component magazines accommodating the electronic components at predetermined positions in a stacked state, and chuck apparatus for receiving the predetermined electronic component selected by the electronic component sequence apparatus and for supplying the electronic component to the second position.

Electronic component selection and supply apparatus in automatic

An apparatus for automatically mounting an electronic circuit element on a printed circuit board which is capable of dealing with an electronic circuit element having two lead wires of the large interval, that having two lead wires of the small interval, and that having three lead wires. The apparatus includes a mechanism for holding and transferring an electronic circuit element to a printed circuit board which comprises a fixed pawl formed with a central recess and a pair of side steps, and a pair of movable pawls openable with respect to the fixed pawl wherein the movable pawls are adapted to be in cooperation with the fixed pawl to securely interpose lead wires of an electronic circuit element positioned in the central recess and one of the side steps between one of the movable pawls and the fixed pawl. The apparatus also includes a mechanism for guiding an electronic circuit element to a printed circuit board which comprises a central guide member formed with a central recess and a pair of side recesses, a pair of outer support member openable with respect to the central guide member and an inner support member openable with respect to the central guide member.

Apparatus for automatically mounting electronic circuit element on

Apparatus for mounting chip type circuit elements on printed circuit boards in one-by-one fashion with increased speed and precision includes a supply unit adapted to supply chip type circuit elements, a plurality of pallets conveyed in an intermittent fashion, a first shifting member adapted to shift the chip type circuit elements from the supply unit onto the pallet, an X-Y table adapted to support a printed circuit board, a mounting mechanism having mounting heads associated therewith for mounting the chip type circuit elements on the printed circuit board supported by the X-Y table and a second shifting member adapted to shift the chip type circuit elements from the pallet to the mounting heads where they are received and positively gripped for subsequent mounting onto the printed circuit board.

Apparatus for mounting chip type circuit elements on printed circuit

Apparatus for mounting chip type circuit elements on a printed circuit board include a supply unit for supplying chip type circuit elements, a plurality of pallets adapted to be conveyed intermittently in a longitudinal direction, a sequence head adapted to shift the circuit elements onto the pallets, an X-Y table adapted to receive and support a printed circuit board, a mounting mechanism having mounting heads adapted to mount the chip type circuit elements on the printed circuit board carried by the X-Y table, and a shifting head for shifting the chip type circuit elements from the pallets to the mounting head of the mounting mechanism. The mounting mechanism constitutes a rotatably indexing disc on which a plurality of mounting heads are radially situated, the sequence heads, shifting head and mounting heads each utilizing suction pins to which the chip type circuit elements are fixed during their movement from the supply unit to the printed circuit board.

Apparatus for mounting chip type circuit elements on a printed circuit board include a supply unit for supplying chip type circuit elements, a plurality of pallets adapted to be connected intermittently in a longitudinal direction, a sequence head adapted to shift the circuit elements onto the pallets, an X-Y table adapted to receive and support a printed circuit board, a mounting mechanism having mounting heads adapted to mount the chip type circuit elements on the printed circuit board carried by the X-Y table, and a shifting head for shifting the chip type circuit elements from the pallets to the mounting head of the mounting mechanism. The mounting mechanism constitutes a rotatably indexing disc on which a plurality of mounting heads are radially situated, the sequence heads, shifting head and mounting heads each utilizing suction pins to which the chip type circuit elements are fixed during their movement from the supply unit to the printed circuit board.

Apparatus for automatically inserting parallel leads of electronic components into openings in a printed circuit board having an improved lead holding and guiding assembly. The improved lead holding and guiding assembly is associated with the frame of the apparatus and includes a guiding member mounted for rotation about an axis of rotation which extends in the x-direction, i.e., in the direction of a line which is orthogonal to both of the parallel leads, and for longitudinal movement in the z-direction, i.e., in the direction which is perpendicular to the orthogonal plane which contains the orthogonally extending line. The holding and guiding assembly further includes a pair of holding members disposed at respective sides of the guiding members such that the side surfaces of the end portion of the guiding member and the respective inner side surfaces of the holding members constitute lead holding and guiding portions. The holding members are mounted for rotation relative to the guiding member about respective axes of rotation so that the lead holding and guiding portions can be opened and closed as the holding members are rotated.

Inserting assembly for automatically inserting parallel lead electronic

An insert sub-assembly of an insert device of a machine for processing and inserting parallel lead electronic components from an electronic component web carrier into lead receiving openings in a printed circuit board includes a first slider device slidably mounted on a frame. A driver mounted on the frame drives the first slider device. A second slider device slidably mounted on the frame cooperates with movement of the first slider device and includes a lead holding and guiding device for holding and guiding an electronic component and a push bar for displacing the component from a predetermined position to an inserted position under the control of the lead holding and guiding device. A feed device mounted on the frame is driven by an intermittent drive to feed the electronic component web carrier intermittently, pitch by pitch. A cutter separates one electronic component from the electronic component web carrier fed by the feed device. A transfer device includes a reciprocating unit for producing reciprocative movements between the cutter and the lead holding and guiding device and an electronic component holding device for holding a lead of the electronic component to be separated by the cutter and transferring the component to the lead holding and guiding device after such component has been separated by the cutter.

Machine for inserting electronic components

A machine for processing and inserting parallel lead electronic components from electronic component web carriers into lead receiving openings in a printed circuit board has improved supply apparatus for selectively receiving an electronic component at a first position and supplying the electronic component to a second predetermined position. The supply apparatus includes a supply sub-assembly having electronic component web carrier apparatus for supporting a plurality of electronic component web carriers at predetermined intervals. Each electronic component web carrier supported by the electronic component web carrier support apparatus is intermittently fed by an intermittent feed device. One electronic component located at the front end of the electronic component web carrier fed by the intermittent feed device is received and gripped at the first position by an electronic component grip device. The electronic component thus received and gripped by the electronic component grip device is separated from the electronic component web carrier by a cutting device. The electronic grip device gripping the electronic component separated by the cutting device is moved to the second predetermined position by a transfer device.

Machine for automatically inserting parallel lead electronic components

A machine for processing and securing parallel lead electronic components into lead receiving openings formed in a printed circuit board having an improved insert assembly is provided. The machine includes a supply assembly for selectively supplying a parallel lead electronic component to be inserted. A transfer assembly including a plurality of chuck assemblies disposed around a rotary disc for supplying the selected electronic component and displacing the supplied electronic component to a release position. An insert assembly including a holding and guiding sub-assembly for receiving the selected electronic component from the chuck at the release position and a push bar sub-assembly adapted to engage the electronic component at the release position and displace the electronic component to an inserted position in the printed circuit board. A table assembly for positioning the receiving openings in the board into alignment with the parallel leads of the electronic component in the insert position such that each electronic component is received in the appropriate receiving openings.

An apparatus re-forms the axial lead of an axial-lead type electronic component into the shape of a U and affixes the electronic components with U-shaped leads to a support tape so as to form a continuous web-carrier carrying a series of electronic components each with a U-shaped lead. The apparatus feeds the electronic component one-by-one to a transfer assembly which transfers the components to a re-forming position and an affixing position in sequence. Means for forming a kink in a lead of each component and for removing excess lead wire are also provided.

Apparatus for re-forming an axial lead of an electronic component into

An apparatus for trimming and securing parallel lead electronic components inserted in a printed circuit substrate is provided. The apparatus includes a selectively rotatable driving assembly selectively displaceable towards an electronic component inserted into a printed circuit substrate, a lead bending assembly mounted on the driving assembly for bending the leads, and a cutting assembly mounted on the bending assembly for cutting the leads, the bending and cutting assemblies actuated by displacement of the driving assembly. The apparatus may include a sub-assembly for disposal of chips removed from the leads during cutting and a detection sub-assembly for detecting the presence of an inserted electronic component.

Growing community of inventors

Tokyo, Japan

Kotaro Harigane