Oji Holdings Corporation

Kotaro Dai

Kei Shinotsuka

Yoshihisa Hatta

Yasuhito Kajita

Koki Hongo

Keiichi Kajita

An antireflective structure having multiple light absorbing units each of which has a bottomed cylindrical shape, the light absorbing unit includes a bottom portion including an outer edge portion having a substantially circular shape, and a wall portion rising along the outer edge portion, and an upper side of the bottom portion is an opening portion, the average height of the wall portions being greater than or equal to 5 &#x3bc;m and smaller than or equal to 100 &#x3bc;m, an average opening diameter of the opening portions being greater than or equal to 1 &#x3bc;m and smaller than or equal to 10 &#x3bc;m, and a pinching structure configured with minute projections that stand in a group with an average pitch greater than or equal to 10 nm and smaller than or equal to 500 nm is formed on the bottom portion.

Antireflective structure

An optical element including, on a substrate, an anti-reflection layer on multiple small concave protrusions, which have a modal pitch less than or equal to a wavelength of light in an environment where the optical element is to be used, are formed; in which 80% or more of the concave protrusions include one or more steps, and satisfy the following conditions: 0.12d&#x2264;w&#x2264;0.17d and 0.42h&#x2264;z&#x2264;0.52h, in which d is a diameter of the concave protrusions, h is a depth of the concave protrusions, wis a total width of the steps in any cut surface; and zis an average depth of the steps.

Optical element

A mold for manufacturing an optical element is provided with a base material, and a recessing and protruding layer formed on a surface of the base material. The recessing and protruding structure of the recessing and protruding layer having a plurality of areas continuously arranged in a positional relationship in which the central point of seven adjacent protrusions is an intersection point of diagonal lines of six vertices of a regular hexagon, and the areas, shapes, and crystal orientations of the plurality of areas are random.

Mold for manufacturing optical element and production method for same, and optical element

An upper surface of a substrate is etched using a first single-particle film as a mask. The first single-particle film is constituted of first particles having a first particle diameter. The upper surface of the substrate is etched using a second single-particle film as a mask. The second single-particle film is constituted of second particles having a second particle diameter. The second particle diameter is different from the first particle diameter.

Method for producing substrate for semiconductor light emitting elements, method for manufacturing semiconductor light emitting element, substrate for semiconductor light emitting elements, and semiconductor light emitting element

A method of manufacturing a semiconductor light emitting device, including arranging a plurality of particles in a monolayer on a substrate, dry etching the plurality of particles arranged to provide a void between the particles in a condition IN which the particles are etched while the substrate is not substantially etched; and dry etching the substrate using the plurality of particles after the particle etching step as an etching mask, thereby forming an uneven structure on one surface of the substrate.

Dry etching method of manufacturing semiconductor light emitting device substrate

A semiconductor light emitting device substrate including an uneven structure on one surface, the uneven structure including numerous convex portions and a flat surface between the convex portions, and multiple areas in which the central portions of seven adjacent convex portions are continuously and positionally aligned to become six vertices and intersection points of diagonal lines of a regular hexagon, and the area, shape and lattice orientation of the plurality of areas are random. A semiconductor light emitting device including the semiconductor light emitting device substrate; and a semiconductor functional layer laminated on the semiconductor light emitting device substrate.

Growing community of inventors

Tokyo, Japan

Kotaro Dai