Kabushiki Kaisha Toyota Jidoshokki

Showa Denko K.k.

Kabushiki Kaisha Toyoda Jidoshokki Seisakusho

Kabushiki Kaisha Toshiba Jidoshokki

Showa Denko Kabushiki Kaisha

Kota Otoshi

Keiji Toh

Katsufumi Tanaka

Eiji Kono

Yuichi Furukawa

Shinobu Yamauchi

Shintaro Nakagawa

Nobuhiro Wakabayashi

Hidehito Kubo

Masahiko Kimbara

Sadanori Suzuki

Ryoichi Hoshino

Takafumi Mizuno

A heat sink () for power module is capable of mounting a power device () on at least a surface of the heat sink. The heat sink includes a refrigerant passage () in which cooling medium that dissipates heat generated by the power device () flows and a corrugated fin body () arranged in the refrigerant passage (). The corrugated fin body () has crests () and troughs () that extend in the flow direction of the cooling medium, and side walls () each of which connects the corresponding one of the crests () with the adjacent one of the troughs (). Each adjacent pair of the side walls () and the corresponding one of the crests () or the corresponding one of the troughs () arranged between the adjacent side walls () form a fin (). Each of the side walls () has a louver () that operates to, at least, rotate the cooling medium flowing in the associated fin (). The heat sink () thus has a further improved heat dissipating performance.

Heat sink for power module

A heat sink for a power module able to realize a further improvement of heat radiating performance and a further improvement of a mounting property is provided. The heat sinkfor a power module has a laminating body, a first side plateand a second side plate. The laminating bodyhas plural flow path platesformed in a plate shape in which plural groovesparallel to each other are concavely arranged on a flat joining face. Each grooveis set to a parallel flow pathparallel to a front face side by laminating each flow path plateby each joining face. A portion other than each grooveof each joining faceforms a heat transfer pathto each parallel flow pathof a laminating direction. A flow-in pathand a flow-out pathare formed in the first and second side plates. The flow-in pathand the flow-out pathare joined to side facesof the laminating body, and are communicated with each parallel flow path. The flow-in pathflows a cooling medium into each parallel flow path. The flow-out pathflows the cooling medium out of each parallel flow path. A refrigerant flow path is constructed by the flow-in path, each parallel flow pathand the flow-out path

A heat radiatorincludes an insulating substratewhose first side serves as a heat-generating-element-mounting side, and a heat sinkfixed to a second side of the insulating substrate. A metal layeris formed on the second side of the insulating substrateopposite the heat-generating-element-mounting side. A stress relaxation memberformed of a high-thermal-conduction material intervenes between the metal layerof the insulating substrateand the heat sinkand includes a plate-like bodyand a plurality of projectionsformed at intervals on one side of the plate-like body. The end faces of the projectionsof the stress relaxation memberare brazed to the metal layer, whereas the side of the plate-like bodyon which the projectionsare not formed is brazed to the heat sink. This heat radiatoris low in material cost and exhibits excellent heat radiation performance.

Heat radiator and power module

A semiconductor moduleincludes a ceramic substrate having a front surface on which a semiconductor elementis mounted and a rear surface on the opposite side of the front surface, a front metal platejoined to the front surface, a rear metal platejoined to the rear surface, and a heat sinkjoined to the rear metal plate. The rear metal plateincludes a joint surfacethat faces the heat sink. The joint surfaceincludes a joint area and a non-joint area. The non-joint area includes recesseswhich extend in the thickness direction of the rear metal plate. The joint area of the rear metal plateis in a range from 65% to 85% of the total area of the joint surfaceon the rear metal plate. As a result, excellent heat dissipating performance can be achieved while occurrence of distortion and cracking due to thermal stress is prevented.

Semiconductor module

A switching power supply includes a sensor for detecting that the output level of the switching power supply has exceeded a rated output level, and a memory that stores data for estimating temperature change of a heat-producing component during a period in which the output level is higher than the rated output level. The data is differentiation data of a curve that represents temperature change characteristics of the heat-producing component. An estimated temperature of the heat-producing component is computed based on the time elapsed from when the output level of the switching power supply exceeds the rated output level and the differentiation data. When the estimated temperature of the heat-producing component reaches an upper threshold temperature, a switching element is deactivated.

Switching power supply and method for stopping supply of electricity when electricity of switching power supply exceeds rated electricity

A driver for a switching device has a plurality of driver circuits for driving the switching device and a control circuit. The control circuit selectively operates the driver circuits in response to a plurality of predetermined drive modes. Alternatively, a driver for a switching device has a driver circuit and a control circuit. The driver circuit is connected to a plurality of power sources. Each of the power sources has a different voltage. The control circuit selects one of the power sources for operating the driver circuit in response to a plurality of predetermined drive modes.

Driver for switching device

A DC-to-AC converting circuit generates an alternating current by alternately switching a set of switching elements. The alternating current is supplied to a load Lo via an output filtering circuit. If a current detection resistor R1 in the DC-to-AC converting circuit detects an output current that exceeds a reference voltage Vref corresponding to an over-current set value, certain switching elements are turned off to disconnect the DC-to-AC converting circuit from the power source. However, the DC-to-AC converting circuit continues to generate an alternating current from energy stored in one or more inductors that are coupled to the DC-to-AC converting circuit. Preferably, a closing circuit is formed from a diode, a switching element, the load Lo and the inductors. Thus, even if the DC-to-AC converting circuit is disconnected from its power source, an alternating current continuously flows to the load Lo.

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Kariya, Japan

Kota Otoshi