Taiyo Holdings Co., Ltd.

Kota Oki

Nobuhiro Ishikawa

Shoko Mishima

Shoya Sekiguchi

Provided is a curable resin laminate capable of easily producing an insulating layer having low dielectric properties and excellent adhesion (peel strength) to a conductor layer. A curable resin laminate includes: a first resin layer including a first curable composition, and a second resin layer including a second curable composition and laminated on the first resin layer. The second resin layer has a thickness of 5 to 35% relative to a total thickness of the first resin layer and the second resin layer, the first curable composition contains (A1) a polyphenylene ether and a filler, and a content rate (M) of the filler is 30% by mass or more relative to a total solid content. The second curable composition contains (A2) a polyphenylene ether, and a content rate (M) of a filler is 40% by mass or less relative to a solid content, M>M, and (A1) and (A2) have a slope that is less than 0.6, calculated by a conformation plot.

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Hiki-gun, Japan

Kota Oki