Tokyo Electron Limited

Tokyo Electron Kyushu Limited

Kosuke Yoshihara

Yusaku Hashimoto

Masatoshi Kawakita

Masatoshi Deguchi

Hideya Tanaka

Norimitsu Morioka

Masami Akimoto

Makoto Muramatsu

Keiichi Tanaka

Teruhiko Kodama

Shinichi Hatakeyama

Yoshihiro Kondo

Shogo Inaba

Yusuke Yamamoto

Yuji Fukuda

A coating method of supplying a treatment solution to a substrate and coating the substrate with the treatment solution by a spin coating method. The method includes mixing a solvent for the treatment solution lower in surface tension than the treatment solution into the treatment solution concurrently with a start of supply of the treatment solution or later than the start of the supply of the treatment solution, and then supplying the treatment solution to the substrate.

Coating method and coating apparatus

A coating method includes supplying a film forming liquid onto a center of a front surface of a substrate from a nozzle in a state that a distance between the front surface and the nozzle is maintained at a coating distance; rotating the substrate at a first rotation speed in a period during which the film forming liquid is supplied onto the front surface, to allow the film forming liquid to be diffused toward an edge of the substrate from an outer periphery of the nozzle; and rotating the substrate at a second rotation speed after the supplying of the film forming liquid is stopped, to allow the film forming liquid to be further diffused. The coating distance is set to allow the film forming liquid to be kept between the nozzle and the front surface when a discharge of the film forming liquid is stopped.

Coating method, coating apparatus and recording medium

A method of processing a substrate, includes emitting light including vacuum ultraviolet light to a front surface of the substrate, which has a resist film formed thereon from a resist material for EUV lithography, before an exposure process in an interior of a processing container.

Substrate processing method, substrate processing apparatus, and storage medium

A method for coating a top of a substrate with a coating solution includes supplying, before a solution film of the coating solution formed on the substrate dries, a solvent for the coating solution to a peripheral portion on the solution film of the coating solution on the substrate while rotating the substrate at a predetermined rotation speed to form a mixed layer of the coating solution and the solvent at the peripheral portion. The method includes, then, controlling a film thickness of the coating solution after drying by rotating the substrate at a rotation speed higher than the predetermined rotation speed to push the mixed layer to an outer peripheral side.

Coating treatment method, computer storage medium and coating treatment apparatus

A resist solution supply apparatus of the present invention includes: a resist solution supply source storing a resist solution therein; a supply tube for supplying the resist solution from the resist solution supply source to a coating nozzle; a filter provided in the supply tube for removing foreign matter in the resist solution; and a heating unit provided along the supply tube at a position closer to the resist solution supply source than the filter, for heating the resist solution in the supply tube to a predetermined temperature higher than room temperature to make a resist gel to aggregate to become coarse so that the coarse resist gel can be collected and removed by the filter.

Resist solution supply apparatus, resist solution supply method, and computer storage medium

A process solution applying apparatus comprising a substrate holding mechanism for holding a substrate, a process solution supplying system for applying process solution in a prescribed amount to the substrate held by the substrate holding mechanism, the process solution supplying system having a supplying mechanism for changing a rate at which the process solution is supplied, and a substrate rotating mechanism for rotating the substrate holding mechanism, thus rotating the substrate at a predetermined speed to spread the process solution by virtue of centrifugal force and to coat the substrate with the process solution.

Apparatus and method for applying process solution

When a resist film is formed by discharging a resist solution onto the front face of a wafer housed in a cup, a relation between the film thickness of a resist film and the line width of a circuit pattern when the resist film is exposed into a predetermined pattern and thereafter developed is obtained in advance, from that relation, a line width with less variations corresponding to the changes in film thickness of the resist film is selected from among line widths within a designated region to form a resist film to have the film thickness corresponding to the selected line width. Accordingly, the line width of the circuit pattern after development is not likely to vary regardless of the changes in film thickness of the resist film formed on the wafer.

Resist film forming method and resist coating apparatus

A resist coating method for forming a resist film on a substrate by supplying a resist solution to substantially a center of a substrate surface while the substrate is rotated, rotating the substrate at a low speed by decelerating the rotation of the substrate after the supply of the resist solution is terminated, and rotating the substrate at a high speed by accelerating the rotation of the substrate after the substrate is rotated at the low speed for a predetermined time-period.

Photoresist coating method and apparatus

A resist processing method includes setting a substrate at a specific temperature, forming a resist film on the substrate by applying a resist solution onto the substrate while turning the substrate set at the specific temperature, heating the substrate on which the resist film has been formed, cooling the substrate a specific temperature after the heating process, wherein the thickness of the resist film on the substrate is measured between the heating process and the cooling process.

Method of and apparatus for processing photoresist, method of evaluating

A developing apparatus for developing a photoresist-coated substrate comprises a spin chuck having a supporting surface smaller in size than the substrate and adapted to be spin-driven with the photoresist-coated substrate surface held upward, a cup surrounding the spin chuck, a developing solution nozzle for applying a developing solution on the photoresist-coated substrate held on the spin chuck, a first washing solution nozzle for applying a washing solution to the photoresist-coated surface of the substrate held on the spin chuck, a second washing solution nozzle for applying the washing solution to a rear surface of the substrate on the spin chuck, a liquid seal ring mounted substantially coaxial with the spin chuck and having a diameter greater than the supporting surface of the spin chuck and smaller than the substrate, and a liquid film forming section provided on an upper end of the liquid seal ring and located near and opposite a peripheral edge portion of a rear surface of the substrate on the spin chuck to provide a clearance relative to the peripheral edge portion of the rear surface of the substrate, in which the liquid film forming section includes a first wall portion situated substantially orthogonal to the rear surface of the substrate and in an outwardly facing relation, and a second wall portion gently inclined relative to the rear surface of the substrate and situated in an inwardly facing relation.

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Koshi, Japan

Kosuke Yoshihara