Toto Ltd.

Kosuke Yamaguchi

Hitoshi Sasaki

Yuichi Yoshii

Kengo Maehata

Yutaka Momiyama

Shuichiro Saigan

Jun Shiraishi

Ikuo Itakura

Kazuki Anada

Jumpei Uefuji

Tatsuya Koga

Hiroki Matsui

Shumpei Kondo

Tetsuro Itoyama

Takara Katayama

An electrostatic chuck includes: a ceramic dielectric substrate; a base plate; and a heater plate. The heater plate includes a first and a second support plates including a metal, a heater element provided between the first and the second support plates, a first resin layer provided between the first support plate and the heater element, and a second resin layer provided between the second support plate and the heater element. A surface of the first support plate on the second support plate side includes a first region and a second region, the first region overlapping the heater element when viewed along the stacking direction, the second region not overlapping the heater element when viewed along the stacking direction. In a cross section parallel to the stacking direction, the second region protrudes toward the second support plate side compared to the first region.

Electrostatic chuck

According to the embodiment, the electrostatic chuck includes a ceramic dielectric substrate having a first major surface and a second major surface on an opposite side to the first major surface, a base plate supporting the ceramic dielectric substrate and including a gas introduction path, and a first porous part provided at a position between the base plate and the first major surface and being opposite to the gas introduction path. The ceramic dielectric substrate includes a first hole part positioned between the first major surface and the first porous part. At least one of the ceramic dielectric substrate or the first porous part includes a second hole part positioned between the first hole part and the first porous part, and a dimension of the second hole part is smaller than a dimension of the first porous part and larger than a dimension of the first hole part.

Electrostatic chuck which reduces arc discharge

According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate having a first major surface placing an object to be processed and a second major surface on an opposite side of the first major surface, and a base plate provided on a side of the second major surface and supporting the ceramic dielectric substrate. The base plate includes a first communicating passage passing a medium which adjusts a temperature of the object to be processed. The first communicating passage has an upper surface, a side surface, and a lower surface. A ratio of variation of a maximum height Sz in the upper surface to a height of the first communicating passage is not more than 1%.

An electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a heater plate. The heater plate is provided between the ceramic dielectric substrate and the base plate. The heater plate includes first and second support plates, first and second resin layers, and a heater element. Each of the first and second resin layers is provided between the first support plate and the second support plate. The heater element includes first and second electrically conductive portions. The first electrically conductive portion is provided between the first resin layer and the second resin layer. The second electrically conductive portion is separated from the first electrically conductive portion in an in-plane direction. The first resin layer contacts the second resin layer between the first electrically conductive portion and the second electrically conductive portion.

According to the embodiment, an electrostatic chuck includes a ceramic dielectric substrate having a first major surface placing a suction object, a second major surface on an opposite side to the first major surface, a base plate supporting the ceramic dielectric substrate and including a gas introduction path, and a first porous part provided at a position between the base plate and the first major surface of the ceramic dielectric substrate and being opposite to the gas introduction path. The first porous part includes a first region positioned on the ceramic dielectric substrate side. The ceramic dielectric substrate includes a first substrate region positioned on the first region side. The first region and the first substrate region are provided in contact with each other, and an average particle diameter in the first region is different from an average particle diameter in the first substrate region.

According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a heater plate. The ceramic dielectric substrate has a surface where a processing object is placed. The base plate supports the ceramic dielectric substrate. The heater plate is provided between the ceramic dielectric substrate and the base plate. The heater plate includes a first support plate including a metal, a second support plate including a metal, a heater element, a first resin layer, and a second resin layer. The heater element is provided between the first support plate and the second support plate. The heater element emits heat due to a current flowing. The first resin layer is provided between the first support plate and the heater element. The second resin layer is provided between the second support plate and the heater element.

According to the embodiment, the first invention relates to an electrostatic chuck. The electrostatic chuck includes a ceramic dielectric substrate having a first major surface placing a suction object and a second major surface on an opposite side to the first major surface, a base plate supporting the ceramic dielectric substrate and including a gas introduction path, and a first porous part provided at a position between the base plate and the first major surface and being opposite to the gas introduction path. The first porous part includes sparse portions including pores and a dense portion having a density higher than a density of the sparse portions. Each of the sparse portions extends from the base plate toward the ceramic dielectric substrate. The dense portion is positioned between the sparse portions. The sparse portions include a wall portion provided between the pores and the pores.

According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, an electrode layer, a base plate, and a heater plate. The ceramic dielectric substrate has a first major surface where a processing object is placed. The electrode layer is provided in the ceramic dielectric substrate. The base plate supports the ceramic dielectric substrate. The heater plate is provided between the base plate and the first major surface. The heater plate includes a first heater element and a second heater element. The first heater element emits heat due to a current flowing. The second heater element emits heat due to a current flowing. When viewed along a direction perpendicular to the first major surface, bends of the first heater element is more than bends of the second heater element, and the first heater element includes a portion positioned at a gap of the second heater element.

An electrostatic chuck includes: a ceramic dielectric substrate having a first major surface, a second major surface, and a through-hole; a metallic base plate which has a gas introduction path that communicates with the through-hole; and a bonding layer which is provided between the ceramic dielectric substrate and the base plate and includes a resin material. The bonding layer has a space which is provided between an opening of the through-hole in the second major surface and the gas introduction path and is larger than the opening in a horizontal direction, and a first area in which an end face of the bonding layer on a side of the space intersects with the second major surface being recessed from the opening further than a second area of the end face which is different from the first area.

According to an aspect of the invention, there is provided an electrostatic chuck including: a ceramic dielectric substrate having a first major surface, a second major surface, and a through-hole; a metallic base plate which has a gas introduction path that communicates with the through-hole; and a bonding layer which is provided between the ceramic dielectric substrate and the base plate and includes a resin material, the bonding layer having a space which is provided between an opening of the through-hole in the second major surface and the gas introduction path and is larger than the opening in a horizontal direction, and a first area in which an end face of the bonding layer on a side of the space intersects with the second major surface being recessed from the opening further than another second area of the end face which is different from the first area.

Growing community of inventors

Kitakyushu, Japan

Kosuke Yamaguchi