Resonac Corporation

Kosuke Urashima

Hiroshi Masuda

Yoshinori Ejiri

Chio Ishihara

Hideo Nakako

Keita Sone

Yuki Kawana

Masaya Toba

Shinichirou Sukata

Motoki Yonekura

Yoshiaki Kurihara

Takaaki Nohdoh

Kazumasa Takeuchi

Teruo Itoh

Arisa Taira

One aspect of the present invention is a method for manufacturing an electronic component, the method including: a first step of applying a metal paste containing metal particles onto a polymer compact in a prescribed pattern to form a metal paste layer; a second step of sintering the metal particles to form metal wiring; a third step of applying a solder paste containing solder particles and a resin component onto the metal wiring to form a solder paste layer; a fourth step of disposing an electronic element on the solder paste layer; and a fifth step of heating the solder paste layer so as to form a solder layer bonding the metal wiring and the electronic element, and so as to form a resin layer covering at least a portion of the solder layer.

Electronic component and method for manufacturing electronic component

A compound for dust core includes a metal powder including iron, a resin composition, and a metal salt, in which the metal salt is represented by RM, R represents a saturated fatty acid group having 6 or more and 12 or less carbon atoms, and M represents at least one metal element between Ca and Ba.

Dust core compound, molded body, and dust core

Growing community of inventors

Tokyo, Japan

Kosuke Urashima