Panasonic Intellectual Property Management Co., Ltd.

Kosuke Takehara

Hisaki Fujitani

Masumi Abe

Naoki Tagami

Toshiaki Kurachi

Toshifumi Ogata

Keiji Kiba

Masashi Funakoshi

Kenji Ueda

A light-emitting module is provided. The light emitting module includes a substrate; a thin-film layer that is disposed above the substrate, the thin-film layer defining an opening that exposes a surface of the substrate; a light-emitting element disposed above the substrate and in the opening; and a sealant disposed above the substrate and in the opening, the sealant containing a wavelength converter and sealing the light-emitting element. A thickness of the thin-film layer is less than a thickness of the sealant. An edge portion of the sealant is in contact with the thin-film layer. The surface of the substrate and a surface of the thin-film layer are hydrophilic. The surface of the thin-film layer has a lower wettability than a wettability of the surface of the substrate.

Light-emitting module and lighting fixture

A light-emitting device includes a plurality of light-emitting elements, a phosphorescent phosphor layer including a green phosphorescent phosphor that emits green light and has an afterglow property, and a sealing resin that disperses the green phosphorescent phosphor. The light-emitting device includes a red phosphor that emits red light, a sealing resin that disperses the red phosphor, and a red phosphor layer that contains only a red phosphor as a phosphor. The phosphorescent phosphor layer and the red phosphor layer are disposed apart from each other, and the light-emitting device emits white light while electric current is supplied to the plurality of light-emitting elements, and emits green light after ending the supply of the electric current to the light-emitting elements.

Light-emitting device

A light-emitting device is provided. The light-emitting device includes a substrate and a base on or defined by the substrate. A light-emitting element is above the base. An adhesive fixes the light-emitting element above the base. A sealant seals the light-emitting element and includes a phosphor that emits fluorescent light when stimulated by light from the light-emitting element. In a plan view of the base and the light-emitting element, a span of at least part of the base is less than or equal to a corresponding span of the light-emitting element.

Light-emitting device, lighting device, and method of manufacturing light-emitting device

A light emitting diode (LED) module which includes: a substrate; a resist including a plurality of layers above the substrate; and an LED element mounted above the substrate. The plurality of layers includes a second layer that is an uppermost layer and a first layer that is an underlying layer. The second layer that is the uppermost layer includes fluorine as a component.

LED module

A light emitting diode (LED) module including: a substrate; a resist including a plurality of layers, above the substrate; and an LED element mounted above the resist via an adhesive. The adhesive includes an addition-reaction type silicone resin. In the resist, a higher positioned layer of the plurality of layers is lower in at least one of sulfur content, phosphorus content, and nitrogen content than a lower positioned layer of the plurality of layers.

LED module with multi-layer resist

An LED module includes a mount board and an LED chip. The mount board includes: an insulation substrate that includes resin and glass; a first conductor, a second conductor and a third conductor; and a white resist layer. The white resist layer is provided with a first opening, a second opening and at least one third opening for exposing the first conductor, the second conductor and the third conductor, respectively. The LED module further includes a wavelength conversion layer disposed between the LED chip and the third conductor in a thickness direction of the LED chip. The wavelength conversion layer includes phosphor particles that are excited by first light emitted from the LED chip to emit second light having wavelengths greater than wavelengths of the first light.

Chip on board type LED module

A light emitting diode (LED) module including: a substrate; a resist including a plurality of layers above the substrate; and an LED element mounted above the substrate. A content percentage of at least one of a phenyl group, an ester bond, and a carbon double bond in a second layer that is an uppermost layer of the plurality of layers is lower than a content percentage of the at least one of the phenyl group, the ester bond, and the carbon double bond in a first layer that is an underlying layer of the plurality of layers, the underlying layer being located below the uppermost layer.

LED module having LED element connected to metal layer exposed by opening in multi-layer resist

A mount substrate includes: an insulation substrate containing resin and glass; connection conductors formed on a surface of the insulation substrate; a first white resist layer that covers the connection conductors; and a second white resist layer that covers the first white resist. Each of the connection conductors includes a copper foil and a plating layer partly formed on the copper foil. The plating layer is formed of metal having oxidation-resistant and corrosion-resistant characteristics higher than those of copper. The first white resist layer is formed with first openings that respectively expose the plating layers of the connection conductors. The second white resist layer covers a periphery of each plating layer of the connection conductors in planar view.

Mount substrate and LED module with the same

A light-emitting device includes a substrate, first LEDs and second LEDs mounted on the substrate, multiple wirings separately formed on the substrate, and a conductive member for connecting adjacent two wirings in multiple wirings for establishing series connection, parallel connection, or a combination of series and parallel connections of the first LEDs and the second LEDs. This achieves the light-emitting device that can support multiple different specifications, using a single type of substrate.

Growing community of inventors

Osaka, Japan

Kosuke Takehara