Fujifilm Corporation

Fujifilm Photonix Co., Ltd.

Kosuke Takasaki

Kazuhiro Nishida

Kazuo Okutsu

Mamoru Iesaka

Kiyofumi Yamamoto

Koji Tsujimura

Hideki Wako

Hitoshi Shimamura

An image pickup device includes: an image pickup element; a spacer surrounding a light receiving surface of the image pickup element; a cover glass attached to the spacer, the cover glass being disposed opposing to the light receiving surface; and an insulative resin configured to thermally couple the image pickup element with the cover glass, and to have a thermal conductivity of not less than 8 W/mK. An endoscope includes: the image pickup device; an image pickup optical system; a drive circuit; a light guide configured to radiate light from a illumination light source; a tubular body configured to accommodate the image pickup device, the image pickup optical system, the drive circuit, the light guide, and a forceps opening; and a first insulative resin having a thermal conductivity of not less than 8 W/mK, and adapted to thermally couple the image pickup device with the drive circuit.

Image pickup device and endoscope

An imaging apparatus includes an observation optical system, a solid state imaging element photoelectrically converting an image from the observation optical system, a flexible board electrically connected to the solid state imaging element, a plurality of electronic components and a plurality of signal cables electrically connected to the flexible board, and a first resin sealing the electronic components and a second resin sealing a connection part of the signal cables. A thixotropic ratio of the first resin is set to be lower than a thixotropic ratio of the second resin. Accordingly, apparatus and an endoscope, which can be made compact, and have high physical and electrical reliability without increasing a size of the imaging apparatus, are provided.

Imaging apparatus and endoscope

A solid-state image sensor () includes: an imaging device wafer (A); a plurality of imaging devices () which are formed on the imaging device wafer (A); a spacer () which surrounds the imaging devices () on the imaging device wafer (A) and is joined to the imaging device wafer (A) with an adhesive (); a transparent protection member () which covers the imaging devices () on the imaging device wafer (A) and is attached on the spacer (); and a plurality of electrostatic discharge protection devices (A) which are formed on the imaging device wafer (A), the electrostatic discharge protection devices (A) being positioned under the spacer (), each of the electrostatic discharge protection devices (A) having diffusion layers () and a well layer () between the diffusion layers (), the well layer () being provided with a channel stopper ().

Solid-state image sensor

A plurality of sensor packages () are fixed to a circuit assembly board () and placed on a lower mold die () of a transfer molding apparatus (). Attached inside a cavity () of an upper mold die () is a protection sheet (), which will make contact with the upper face of a cover glass () of each sensor package (). When the upper mold die () meshes with the lower mold die (), the upper face of the cover glass () is tightly covered with the protection sheet (). A plunger () is activated to fill the cavities () with sealing resin (). The upper face of the cover glass () is not stained or damaged when the peripheries of the sensor packages () are sealed.

Solid state imaging device and manufacturing method thereof

A device for joining substrates () is provided inside a clean booth (). a single axis robot () and a five axis robot () convey a wafer () and a glass substrate (). A transcribing station () obtains a transcribing film () on which adhesive is applied from a film supplying section (), and presses the transcribing film () to the glass substrate () so as to transcribe the adhesive to the glass substrate (). A peeling station () peels the transcribing film () from the glass substrate (). A joining station () positions the wafer () and the glass substrate (), adjusts parallelism of joining surfaces of the wafer () and the glass substrate (), and joins these substrates together. Since the handling and the joining of the wafer (), the glass substrate () and the transcribing film () are performed in the clean booth, it is prevented that a yield ratio of the product decreases because of the adhesion of foreign matters.

Device and method for joining substrates

A transfer film, on which an adhesive is applied, is glued to plural spacers formed on a glass substrate. The glass substrate is laid on a working table, and one end of the transfer film is fixed to a winding roller. A peeling guide is set at a position over the transfer film. The winding roller is driven to wind the transfer film while the working table moves horizontally. While winding the transfer film, the angle between the glass substrate and the transfer film is kept constant. After the transfer film is peeled off, the adhesive is uniformly transferred to each of the spacers.

Growing community of inventors

Kanagawa, Japan

Kosuke Takasaki