Ube Industries, Inc.

Ube Corporation

Kosuke Oishi

Hiroaki Yamaguchi

Nobuharu Hisano

Tetsuya Yasui

Shin-ichiro Kohama

Taizou Murakami

Hitoshi Kodama

Yuki Suedomi

Akane Sakamoto

Mikako Fujita

Takashi Kumagai

The present invention relates to a polyamide resin composition that is excellent in mechanical characteristics, bonding properties and calcium chloride resistance and is suitably bonded to an acid-modified polyolefin, wherein the polyamide resin composition includes 70 to 99 mass % of an aliphatic polyamide resin (A) having an amino group concentration of 46 to 110 μmol/g, 0 to 18 mass % of an aromatic polyamide resin (B), 0.01 to 0.50 mass % of a polyalkylene glycol alkyl ether (C), 0.01 to 0.50 mass % of a polyolefin wax (D) and 0 to 22.98 mass % of a component (E) other than (A) to (D), and the total of (A) to (E) is 100 mass %, and wherein the acid-modified polyolefin having an amount of acid modification of 8 to 100 μmol/g.

Polyamide resin composition

A method for manufacturing a polyimide-metal laminate including forming a polyimide film, in which at least surfaces of both sides of the film are formed by thermally fusion-bondable polyimide layers (a), and thermal compression-bonding metal layers on both sides of the polyimide film; in which forming the polyimide film includes reacting a tetracarboxylic dianhydride component with a diamine component containing a diamine compound represented by general formula (1) to give a solution of a polyamic acid (a), forming a self-supporting film from the solution of the polyamic acid (a) and imidizing the self-supporting film by heating at a maximum heating temperature of 440&#xb0; C. or lower to form the polyimide layer (a); 

Method for manufacturing polyimide metal laminate

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Ube, Japan

Kosuke Oishi