Murata Manufacturing Co., Ltd.

Kosuke Nishino

Kuniaki Yosui

Takahiro Baba

Nobuo Ikemoto

Genro Kato

Akihiro Kikuchi

Jun Sasaki

An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.

Electronic apparatus and electrical element

An electronic device includes a circuit board and an electric element mounted on the circuit board. The electric element includes a multilayer body made of electrically insulating base materials, a transmission line portion, and connection portions. The transmission line portion and the connection portions are provided in the multilayer body. Each of the connection portions is continuous with a corresponding portion of the transmission line portion, and is connected to the circuit board by an electrically conductive bonding material. The transmission line portion other than the connection portions is not electrically connected to an electronic component on the circuit board. The electronic component not electrically connected to the electric element is disposed between the transmission line portion of the electric element and the circuit board.

Electronic device

A stacked body includes a base including a plurality of insulating base material layers, a coil including a winding-shaped conductive pattern located on at least one of the plurality of the insulating base material layers, and an electrically isolated dummy pattern extending along at least a portion of the coil outside of the coil on at least one of the plurality of the insulating base material layers in a plan view, wherein the stacked body includes a step at which a thickness of the stacked body is different in a stacking direction, and the dummy pattern is located between the coil and the step at a portion defining the step where the thickness of the stacked body is larger.

Stacked body and method of producing stacked body

An electronic apparatus includes a first substrate and a second substrate mounted on the first substrate and having a smaller area than the first substrate. The second substrate extends in a longitudinal direction and has a planar or substantially planar shape with a uniform or substantially uniform width across all portions of the second substrate in the longitudinal direction. The second substrate includes a signal line, and a high-frequency transmission line including the signal line, and further includes an input/output pad electrically connected to the signal line, and an auxiliary pad arranged between two input/output pads, on the mounting surface of the second substrate. The first substrate includes lands each connected to the input/output pad and the auxiliary pad. The input/output pad and the auxiliary pad are each soldered on each of the lands of the first substrate and, thus, the second substrate is surface-mounted on the first substrate.

Electronic apparatus

A stacked body includes a base including insulating base material layers made of thermoplastic resin and stacked, a circuit including a conductive pattern located on the insulating base material layers, and a dummy pattern electrically isolated from the circuit and extending along a portion of the circuit outside of the circuit on the insulating base material layers on which the conductive pattern is located in a plan view. The conductive pattern includes a linear portions at an outermost side of the circuit in a plan view. A bent portion or a wide portion, which has a larger width than the other linear portions in a direction perpendicular or substantially perpendicular to a direction in which a linear portion extends, in a plan view, is located on at least one of the linear portion of the conductive pattern and the dummy pattern extending along the linear portion.

An electromagnet includes a stacked body formed by stacking and thermocompression-bonding a plurality of insulating base materials having thermoplasticity and including wound linear conductors which define a spiral coil. In a region of each of the insulating base materials surrounded by each of the wound linear conductors, each of low mobility members is formed of a material having mobility lower than that of the insulating base materials at a temperature upon thermocompression-bonding of the insulating base materials.

Method of manufacturing stacked body and stacked body

Electronic apparatus, electrical element, and electrical element tray

Method of manufacturing electromagnet, and electromagnet

An electromagnet that increases electromagnetic force involved with a current flowing through a coil includes a stacked body including a plurality of base material layers, a coil including an in-plane coil conductor on one main surface of each of the base material layers, and an electrically isolated dummy pattern extending along at least a portion of the coil outside of the in-plane coil conductor on each of the base material layers in a plan view.

Electromagnet, camera lens driving device, and production method of electromagnet

An electronic apparatus includes a transmission line member and a mount circuit board. The transmission line member includes a dielectric base body, a first signal conductor, a first ground conductor, a second ground conductor, and a first transmission line that transmits a first high frequency signal and is defined by the first signal conductor interposed between the first and second ground conductors. The mount circuit board is wrapped by the transmission line member such that the transmission line member covers the mount circuit board from a top surface to a back surface via a side surface of the mount circuit board. At least one of an IC chip, a mount component, and a battery pack is mounted on the mount circuit board and is wrapped by the transmission line member so as to be disposed on an inner peripheral side of the transmission line member.

In an LC composite component, a chip capacitor is built in a multilayer substrate including base material layers made of a thermoplastic resin. The number of the base material layers in a portion overlapping the component as seen from a lamination direction is equal to the number of the base material layers in a portion around the component as seen from the lamination direction. Wiring patterns that adjust the thickness of the multilayer substrate are provided around the chip capacitor as seen from the lamination direction, and on principal surfaces of the base material layers, so as to surround the chip capacitor.

Growing community of inventors

Nagaokakyo, Japan

Kosuke Nishino