Kanegafuchi Kagaku Kogyo Kabushiki Kaisha

Kaneka Corporation

Kosuke Kataoka

Eiichiro Kuribayashi

Yoshihide Ohnari

Kiyokazu Akahori

Hirosaku Nagano

Hiroyuki Furutani

Kazuhiro Ono

Yasuo Fushiki

Naoki Hase

Masao Nakata

The present invention provides a method for producing a laminate suitable for a flexible circuit board which is free from visual defects such as wrinkles and curls that appear when a plurality of laminating materials containing a thermally fusible laminating material are formed by thermally laminating these materials each other using a thermal-press forming device, which comprises the steps of: arranging a heat resistant protective material between a pressing surface and the laminating materials, laminating the materials by thermal pressure at not lower than 200&#xb0; C., wherein the bonded laminating materials are in contact with the protective material, cooling the bonded laminating materials, and peeling off the protective material from the bonded laminating materials, whereby the laminate with less nonuniformity in pressurization, a uniform surface, and a good inter-layer adhesion, and the method and device for producing the laminate can be provided, more particularly, the thermal pressure and forming is performed by a thermal-press forming device having at least a pair of metal rolls.

Method and device for manufacturing laminated plate

The present invention provides a reformed polyimide fluorocarbon resin laminated film having superior adhesive property with metals. The reformed polyimide fluorocarbon resin laminated film according to the present invention is constructed by that a surface of fluorocarbon resin of polyimide fluorocarbon resin laminated film having fluorocarbon resin being laminated on a single surface or both surfaces of a polyimide film is coated with a coupling agent, or executed with corona treatment.

Reformed polyimide fluorocarbon resin laminated film

A fluoro-carbon resinous laminate has a crack-resistant surface on a fluoro-carbon resinous layer thereof produced by coating a single surface or both surfaces of a plastic film with a single layer of a fluoro-carbon resinous dispersion, and a method of producing the laminate. To produce the fluoro-carbon resinous laminate, which is a minimum of 10 .mu.m in thickness, a single surface or both surfaces of a plastic film are coating with a single layer of concentration-adjusted fluoro-carbon resinous dispersion and then dried, followed by curing the resinous dispersion in a thermal treating furnace with heated atmospheric air or by adding organic solvent to the resinous dispersion, the enabling production of a fluoro-carbon resinous laminate having a surface appearance in which cracks cannot visually be identified.

Fluoro-carbon resinous laminate having a crack-resistant surface and

The invention solves a problem of that sufficient adhesive intensity to satisfy recent demand for high adhesive property cannot be obtained by conventional surface treatment, and provides a method of improving adhesive property of polyimide film and achieving distinctly improved effect of adhesive property. The invention further provides novel polyimide film having improved adhesive property. A method for improving adhesive property of polyimide film according to the present invention comprises a combination of steps of; execution of a liquid applying process for treating polyimide film surface by exerting physical mechanical force on said film surface under the condition of that said film surface remains wet with water or organic solvent, or solution of organic solvent or aqueous solution; and execution of a surface treatment process for treating polyimide film surface by performing selected treatment among flame treatment, alkaline treatment, coupling agent treatment or surface treatment by way of projecting grinding material of fine grading onto film surface at high velocity, and said steps are performed in an arbitrary order. For example, using a surface treating device 10 shown in FIG. 1, consecutive execution of a surface treatment process for treating film surface, a liquid applying process and a drying process is realized by that polyimide film 22 is run from a feeding device 18 to a winding device 20.

Method of improving adhesive property of polyimide film and polymidefilm

The object of the invention is to embody further thinning of a double layer flexible printed circuit board (FPC) and provide a flexible copper-coated laminate capable of producing such a novel flexible printed circuit board distinguished in bending characteristic and heat-resistant property and provide a printed circuit board using the novel flexible copper-coated laminate. To achieve the above object, novel flexible copper-coated laminates 10 and 12 according to the present invention are respectively composed by directly forming a copper layer 16 having a thickness of 10 .mu.m or less than 10 .mu.m on a single surface or both surfaces of polyimide film 14 which is composed of polyimide polymer containing modulus of initial tensile elasticity of 400 kg/mm.sup.2 or more than 400 kg/mm.sup.2, and which has a thickness of 10 .mu.m or less than 10 .mu.m.

Growing community of inventors

Otsu, Japan

Kosuke Kataoka