Shindengen Electric Manufacturing Company Limited

Mitsubishi Heavy Industries Limited

Adv Antest Corporation

Mitsubishi Heavy Industries Plastic Technology Co., Ltd.

Sato Special Oil, Ltd.

Kosuke Ikeda

Osamu Matsuzaki

Yoshiaki Hiruma

Yuji Morinaga

Ryoji Okabe

Masakatsu Suda

Yasunori Watanabe

Katsuhiko Degawa

Kengo Suzuki

Yushi Nishino

Masanori Takahashi

Masaki Kimura

Toshihiko Kariya

Ira Leventhal

Kenichi Suzuki

Naoki Toda

Yukio Takeuchi

Keith Schaub

Yoshinao Komatsu

Wataru Nishimura

Takeshi Yamaguchi

Toshikatsu Nohara

Kiyoshi Kinoshita

Munehiro Nobuta

Kazuyuki Sashida

Norihisa Horaguchi

Masaru Seto

Yuji Suzumura

Hitoshi Onuma

Yuusuke Sakama

An electronic device has a primary coil; a secondary coildisposed to face the primary coil; a coil sealing partsealing the primary coiland the secondary coiland being made of sealing resin; a primary-side electronic elementelectrically connected to the primary coil; and a secondary-side electronic elementelectrically connected to the secondary coil. The primary-side electronic elementis provided on a primary-side extension partextending from the primary coilto an outside of the coil sealing part, or the secondary-side electronic elementis provided on a secondary-side extension partextending from the secondary coilto an outside of the coil sealing part

Electronic device

A magnetic component has a primary coil; a secondary coildisposed to face the primary coil; a corewhich passes through the primary coiland the secondary coil; and a coil sealing partwhich seals at least the primary coiland the secondary coil, and a part or whole of region between the primary coiland the secondary coiland the core

Magnetic component

An electronic device has a primary coil; a secondary coildisposed to face the primary coil; a coil sealing partsealing the primary coiland the secondary coiland being made of sealing resin; a primary-side sealing partsealing a primary-side electronic elementelectrically connected to the primary coil; and a secondary-side sealing partsealing a secondary-side electronic elementelectrically connected to the secondary coil

An electronic device has a primary coil; a secondary coildisposed to face the primary coil; a primary-side electronic elementelectrically connected to the primary coil; and a secondary-side electronic elementelectrically connected to the secondary coil. The primary coilhas a primary-side first coilthat is provided on another side of the secondary coil, and a primary-side second coilthat is provided on one side of the primary-side first coil. A connecting partconnecting the primary-side first coiland the primary-side second coilis provided and passes through a space of the secondary coil

An electronic module has a first substrate; a first electronic elementprovided on one side of the first substrate; a first connection bodyprovided on the one side of the first electronic element; a second electronic elementprovided on the one side of the first connection body; and a second connection bodyprovided on the one side of the second electronic element. The first electronic elementand the second electronic elementdo not overlap in a plane direction.

Electronic module

An electronic module has a first substrate, a first electronic element, a second electronic element, a second substrate, a first terminal partprovided on a side of the first substrateand a second terminal partprovided on a side of the second substrate. The first terminal parthas a first surface direction extending partand a first normal direction extending partextending toward one side or the other side. The second terminal parthas a second surface direction extending partand a second normal direction extending partextending toward one side or the other side. The second surface direction extending partis provided on one side of the first surface direction extending part, and the first surface direction extending partand the second surface direction extending partoverlap one another in a surface direction.

An electronic module has an electronic element; a connection bodyprovided on a front face of the electronic element; and a detection parthaving a winding wire partprovided so as to surround the connection body, and a winding return wire partconnected to a terminal end part of the winding wire partand returns from the terminal end part toward a starting end part.

An electronic module has a first substrate, an electronic elementdisposed on one side of the first substrate, a second substratedisposed on one side of the electronic element, a first coupling bodydisposed between the first substrateand the second substrate, a second coupling bodydisposed between the first substrateand the second substrate, and shorter than the first coupling body, and a sealing partwhich seals at least the electronic element. The first coupling bodyis not electrically connected to the electronic element. The second coupling bodyis electrically connected to the electronic element

Electronic module and method for manufacturing electronic module

An electronic module has a first electronic element, a first connectorprovided in one side of the first electronic element, and having a first columnar partextending to another side and a first groove partprovided in a one-side surface, and a second electronic elementprovided in one side of the first connectorvia a conductive adhesive agent provided inside a circumference of the first groove part. The first connectorhas a first concave parton one side at a position corresponding to the first columnar part

Electronic module, method of manufacturing connector, and method of manufacturing electronic module

An electronic module has a first substrate; a second substrateprovided in one side of the first substrate; and a chip moduleprovided between the first substrateand the second substrate. The chip modulehas an electronic elementand a connecting bodyelectrically connected to the electronic element. The electronic elementextends along a first direction that is a thickness direction of the electronic module.

An electronic module has a first substrate; an electronic elementprovided on one side of the first substrate; a sealing partthat seals at least the electronic element; a connection terminalelectrically connected to the electronic elementand exposed from a side surface of the sealing part; and a stress relaxation terminal, which is not electrically connected to the electronic element, exposed from the side surface of the sealing part

An electronic module has a first substrate, a first electronic elementprovided on one side of the first substrate, a first connection bodyprovided on one side of the first electronic element, a second electronic elementprovided on one side of the first connection body, a second substrateprovided on one side of the second electronic element, and an abutment bodythat abuts on a face on one side of the second electronic elementand is capable of imparting a force toward one side with respect to the second substrate

An electronic module has a first substrate, a first conductor layerthat is provided on one side of the first substrate, a first electronic elementthat is provided on one side of the first conductor layer, a second electronic elementthat is provided on one side of the first electronic element, and a second connecting bodythat has a second head partprovided on one side of the second electronic elementand an extending partextending from the second head partto the other side and abutting against the first substrateor the first conductor layer

A method of manufacturing a chip module comprises a step of disposing a first electronic elementon a first jig, a step of disposing a first connectoron the first electronic elementvia a conductive adhesive, a step of disposing a second electronic elementon the first connectorvia a conductive adhesive, a step of disposing a second connectoron a second jig, a step of reversing the second jig in a state where the second connectoris fixed to the second jigand disposing the second connectoron the second electronic elementvia a conductive adhesive, and a step of curing the conductive adhesives

Method of manufacturing chip module

Provided is an examination apparatus including a target image acquiring section that acquires a target image obtained by capturing an examination target; a target image masking section that masks a portion of the target image; a masked region predicting section that predicts an image of a masked region that is masked in the target image; a reproduced image generating section that generates a reproduced image using a plurality of predicted images predicted respectively for the plurality of masked regions; and a difference detecting section that detects a difference between the target image and the reproduced image.

Examination apparatus, examination method, recording medium storing an examination program, learning apparatus, learning method, and recording medium storing a learning program

Growing community of inventors

Hanno, Japan

Kosuke Ikeda