Sumitomo Chemical Company, Limited

Koshiro Ochiai

Masumi Suetsugu

Katsuhiko Namba

Nobuhito Fukui

Koji Ichikawa

Akira Kamabuchi

The present invention provides a positive resist composition comprising

Positive resist composition

An industrially excellent process for producing a poly(meth)acrylate having a reduced metal content which comprises contacting a mixture of a poly(meth)acrylate and an organic solvent with an acidic aqueous solution, such as an aqueous solution obtained by dissolving a polyprotic carboxylic acid having about 2 to 12 carbon atoms in water, is provided, and, by this invention, contents of metals such as sodium, potassium, iron and the like can be remarkably reduced.

Process for producing poly (meth) acrylates having reduced metal content

Chemical amplification type positive resist composition

A photoresist composition which is particularly useful as a chemical amplification type photoresist is provided, wherein the photoresist composition contains a resin having a structural unit represented by the following formula (I):

Photoresist compositions

A photoresist composition comprising a resin having structural units represented by the following formulas (I), (II) and (III): ##STR1## wherein R.sup.1, R.sup.2, R.sup.3, R.sup.11, R.sup.12, R.sup.13, R.sup.21, R.sup.22 and R.sup.23 each independently represents hydrogen or an alkyl; one of R.sup.14, R.sup.15 and R.sup.16 represents an aliphatic hydrocarbon residue and the rest each independently represents hydrogen or an aliphatic hydrocarbon residue, or two or three of R.sup.14, R.sup.15 and R.sup.16 form a hydrocarbon ring; and R represents a group cleavable by an action of an acid; and the photoresist composition affords excellent resolution, excellent profile and wide focus margin even on a substrate provided with an organic anti-reflective film.

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Toyonaka, Japan

Koshiro Ochiai