Japan Pionics Co., Ltd.

Koshi Ochi

Satoshi Arakawa

Kenji Otsuka

Kenji Ohtsuka

Youji Nawa

Tomohisa Ikeda

A cleaning process of exhaust gas which includes the steps of bringing the exhaust gas containing at least one of nitrogen oxides or organic solvent into contact with a cleaning agent including metal as a reductive cleaning agent component and metal oxide as an oxidative cleaning agent component or including lower valent metal oxide as a reductive cleaning agent component and higher valent metal oxide as an oxidative cleaning agent component while heating them. A cleaning process of exhaust gas containing nitrogen oxides and/or organic solvent with high and varying concentration discharged from a manufacturing process of semiconductor capable of easily cleaning at relatively low temperature and with high decomposition factor without using large-scale cleaning apparatus or a complicated structural cleaning apparatus is provided.

Method for clarifying exhaust gas

There are disclosed a decompositionally treating agent for fluorocarbons which comprises an aluminum compound and a lanthanoid compound as effective ingredients; a decompositionally treating agent for fluorocarbons which comprises an aluminum compound, a lanthanoid compound and an alkaline earth metal compound as effective ingredients; and a decompositionally treating method for fluorocarbons which comprises decomposing a fluorocarbon by bringing a fluorocarbon-containing gas into contact under heating with a decompositionally treating agent mentioned above or by bringing the above gas into contact under heating with a decompositionally treating agent comprising aluminum oxide as an effective ingredient and thereafter with a decompositionally treating agent comprising a lanthanoid oxide and an alkaline earth metal oxide. It is made possible by the above agent and method to decompose the fluorocarbons contained in an exhaust gas exhausted from a semiconductor manufacturing industry and the like at a decomposition rate of at least 99.9% at a relatively low decomposition temperature of 1000&#xb0; C. or lower without deactivating the agent in a short time, or exhausting a corrosive gas such as hydrogen fluoride in the atmosphere.

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Kanagawa, Japan

Koshi Ochi