Toyoda Gosei Co., Ltd.

Kosei Fukui

Satoshi Wada

Toshimasa Hayashi

Hideki Kokubu

Takashi Nonogawa

Takashi Terayama

A light emitting device includes: a substrate; an electrode pattern formed on the substrate; a light emitting element connected to the electrode pattern; a ridge-shaped resin covering portion which covers a part of the electrode pattern, and which includes a first and second outer edge portions; first and second through holes formed to penetrate through the electrode pattern such that the substrate is exposed; and first and second hole arrays including the first and second through holes arranged along the first and second outer edge portions, respectively. The first and second outer edge portions cover at least a part of the first and second through holes, respectively, and are bonded to the substrate in the first and second through holes, respectively.

Light emitting device

Light emitting diode

A light emitting device includes a light emitting element and a luminescent color conversion layer covering a light emitting surface of the light emitting element. The luminescent color conversion layer includes a transparent synthetic resin material and integrated particles provided inside the transparent synthetic resin material, each of the integrated particles being a mixture of phosphors and a dispersively binding material that are bonded to each other. The dispersively binding material has transparency and bondability to the phosphors. The luminescent color conversion layer is arranged such that primary light and secondary light are mixed to generate a mixed color light and such that the mixed-color light is emitted outside from the luminescent color conversion layer, the primary light being excitation light emitted by the light emitting element, and the secondary light being a portion of the primary light that has been is color-converted by an excitation of the phosphors.

A light emitting device includes a substrate, a light-emitting diode chip mounted on the substrate, a Zener diode chip mounted next to the light-emitting diode chip on the substrate, a frame-like dam material formed on the substrate to surround the light-emitting diode chip and the Zener diode chip, and a light-reflective resin injected inside the dam material to coat side surfaces of the light-emitting diode chip and side surfaces and an upper surface of the Zener diode chip. A part of the frame-like dam material swells outward to surround three of the side surfaces of the Zener diode chip.

Light emitting device and method for manufacturing the same including a light-reflective resin

A light-emitting device includes a plurality of LED chips arranged in series and each including a chip substrate and a crystal layer including a light-emitting layer. One of the plurality of LED chips is configured such that the chip substrate thereof includes a side surface facing another adjacent LED chip of the plurality of LED chips. The side surface has a highest cleavability among all side surfaces of the chip substrate of the one of the plurality of LED chips.

Light-emitting device

The present invention provides a light emitting device, which includes a light emitting diode (LED) chip, a wavelength conversion plate including a fluorescent substance and disposed on a light output surface side of the LED chip, and a sub heat radiation path formed to radiate heat of the wavelength conversion plate. The sub heat radiation path includes a transparent heat-conductive film provided on a surface of the wavelength conversion plate, a heat radiator provided in the vicinity of the LED chip, and a thermal connection member that thermally connects the transparent heat-conductive film to the heat radiator.

Light emitting device and manufacturing method for the same

A light emitting device comprises a case having a space therein, the space defined by an inner bottom surface and an inner side surface of the case, a lead frame housed in the space, and having a bending portion bent along the inner side surface of the case, and a light emitting element electrically connected to the lead frame, wherein a rear surface of the bending portion is embedded in the case and a front surface of the bending portion is exposed from the inner side surface of the case so as to oppose the light emitting element, and wherein a projecting portion projected from the inner bottom surface and inclined to the inner side surface of the case is formed on the inner side surface of the case.

Growing community of inventors

Kiyosu, Japan

Kosei Fukui