Samsung Electronics Co., Ltd.

Kook-Jin Oh

Sang-Woo Lee

Tae-Hyun Kim

Byung-Soo Kim

Young-Kyun Sun

Joon-gil Lee

Youn-sung Ko

Dong-Bin Kim

Suk-Chun Jung

Dae-Soo Kim

Young-Han Kwon

Tae-Hyuk Kim

Jae-Yun Lim

The apparatus for transferring the semiconductor chip includes: a holder member including a first vacuum hole connected to a vacuum line; a plate member including at least one second vacuum hole corresponding to the first vacuum hole and redistributed to edges of the plate member, the plate member combined with the holder member; and an absorption member including at least one third vacuum hole corresponding to the second vacuum hole and a groove connected to the third vacuum hole, the absorption member combined with the plate member and the holder member.

Apparatus for transferring semiconductor chip

A bonder viewer system may provide an automated procedure for determining a wire bonding sequence based on information provided by a drawing management system. The bonder viewer system may include a bonding sequence decision unit receiving pad and lead coordinate data corresponding to an IC chip, and determining a bonding sequence for bonding wires of the IC chip. The bonder viewer system may further include a turning point check unit and a bonding simulation unit which may provide modifications to the bonding sequence information, which may be based on whether a capillary of a wire bonder is in contact with a pre-bonded wire of the IC chip. The bonder viewer system may also include a standard file generator for generating data based on the bonding sequence information and a translator for preparing the data in a format suitable for a wire bonder.

System and method for automated wire bonding

A controller may receive a wire disconnection signal from a wire bonding monitoring system and operate a wire clamp to clamp a disconnected wire. A series of operations, which may include a wire drawing operation, a wire tail forming operation and a ball forming operation, may be automatically performed. A sensor may measure the length of the wire drawn through the capillary and the location of a ball that may be formed at a wire tail. An auxiliary clamp may be installed between the wire clamp and the capillary for drawing the wire using sensor information.

Wire bonding apparatus and method for clamping a wire

Growing community of inventors

Cheonan-si, South Korea

Kook-Jin Oh