University of Florida Research Foundation Inc

Cascade Microtech, Inc.

Kooho Jung

Kenneth R Smith

K Reed Gleason

Eric W Strid

William Richard Eisenstadt

Richard Lynn Campbell

Robert M Fox

High frequency interconnect structures, electronic assemblies that utilize high frequency interconnect structures, and methods of operating the same. The high frequency interconnect structures include a plurality of dielectric waveguides and are configured to communicatively connect a plurality of transmitters with a plurality of receivers and to convey a plurality of signals therebetween. The plurality of signals may include a plurality of electromagnetic waves and may have a frequency of at least 200 GHz. The high frequency interconnect structures further may be configured to decrease a potential for crosstalk between a first signal that is conveyed by a first dielectric waveguide of the plurality of dielectric waveguides and a second signal that is conveyed by a second dielectric waveguide of the plurality of dielectric waveguides, such as through control of a passband of the first dielectric waveguide relative to the second dielectric waveguide and/or the use of a crosstalk mitigation structure.

High frequency interconnect structures, electronic assemblies that utilize high frequency interconnect structures, and methods of operating the same

A broadband active balun configuration is provided. According to embodiments, the subject active balun can include a cascade and cascade transistor pair using a shared input transistor. In a further implementation, a low-pass bias-feedback mechanism for maintaining stable bias conditions can be provided.

Broadband active balun

Growing community of inventors

Beaverton, OR, United States of America

Kooho Jung