Samsung Electronics Co., Ltd.

Kongwoo Lee

Jinhyuk Choi

Beomsoo Hwang

Kyusang Lee

Myungki Song

Jonghwi Seo

Donghyun Kim

Jisu Kim

Keonwoo Kim

Daeyong Kim

Jooyoung Park

Duckjin Kim

Kihong Park

Jungjun Park

Seojoo Choi

Hyunjoo Jeon

Hyunwoong Choi

Hyunyoung Lee

Jeongmin Hwang

Hoseok Song

Jongseong Ko

Chiho Ahn

Junhyeok Park

Pyungkang Kim

Chuyoung Choung

Jungjoon Park

A semiconductor processing device includes a stage configured to receive a bare wafer placed thereon, a laser sensor located above the stage in a vertical direction, orthogonal to an upper surface of the bare wafer, a camera sensor located above the stage in a first direction, a lighting device radiating an imaging region imaged by camera sensor with light, and a controller, configured to rotate the bare wafer using the stage, obtain a plurality of sub-images of the bare wafer captured by the camera sensor to generate an original image of the bare ware, and detect a first defect of the bare wafer using the original image, wherein the controller is configured to detect a second defect of the bare wafer by measuring a distance between the laser sensor and the bare wafer, while rotating the bare wafer using the stage.

Semiconductor processing device and semiconductor processing system

A semiconductor substrate processing apparatus includes a substrate transfer module including a chamber having an internal space extending in a first direction within the chamber, at least one pair of first load ports at opposite sides of the chamber, to face in a second direction intersecting the first direction, and configured to rotate and move a substrate carrier, a load lock at a rear surface of the chamber, and a robot arm configured to move in the first direction in the internal space of the chamber, a transfer chamber connected to the load lock of the substrate transfer module, a plurality of processing chambers connected to the transfer chamber, and a transfer arm inside the transfer chamber, and configured to unload the semiconductor substrate from the load lock and to load the semiconductor substrate into at least one of the plurality of processing chambers.

Semiconductor substrate processing apparatus

A fastening device includes: a support portion including a first end portion, and a second end portion, and a central portion between the first and second end portions; a first pulley, a second pulley, and a third pulley rotatably disposed on the central portion, the first end portion, and the second end portion, respectively; a first connection portion and a second connection portion respectively rotatably disposed on the first and second end portions and respectively connected to the second and third pulleys; a first fastening tool and a second fastening tool respectively connected to the first and second connection portions; and a motor connected to the first pulley, wherein a force generated by the motor and provided to the first pulley is at least partially transmitted to the second and third pulleys to vary a distance between the first and second fastening tools.

Fastening device and fastening system including the same

A loadlock apparatus includes a loadlock chamber including a first opening and a second opening separated in a vertical direction; a first slit valve including a first valve plate configured to move between a first open position where the first opening is open and a first closed position where the first opening is closed, the first open position being a position moved downward from the first closed position; and a second slit valve including a second valve plate configured to move between a second open position where the second opening is open and a second closed position where the second opening is closed, the second open position being a position moved upward from the second closed position.

Loadlock apparatus and substrate processing apparatus including the same

A wafer transfer apparatus includes a controller, a wafer transfer robot including a hand unit configured to hold a wafer, a driving unit connected to the hand unit and configured to move the wafer, and a sensor unit provided on the driving unit, and a plurality of transfer structures configured to exchange the wafer with the wafer transfer robot, each of the plurality of transfer structures including a plurality of markers recognizable by the sensor unit, where the sensor unit includes a camera sensor recognizing the plurality of markers and a laser sensor configured to measure distances to the plurality of markers by emitting a laser to the plurality of markers and receiving the laser reflected from the plurality of markers.

Wafer transfer apparatus with aligner

A wafer processing apparatus may include a plurality of equipment front end modules (EFEMs), a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. Each of the plurality of EFEMs may include an EFEM chamber, a plurality of load ports provided at a side of the EFEM chamber, and a load lock provided at a side of the EFEM chamber to overlap with at least one of the plurality of load ports in a vertical direction.

Wafer processing apparatus including EFEM and method of processing wafer

A wafer processing apparatus of an embodiment of the present disclosure may include an equipment front end module (EFEM), a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. In addition, the EFEM may include an atmosphere control chamber configured to store a wafer carrier accommodating wafers, an upper air supplier configured to supply air into the atmosphere control chamber, an EFEM chamber under the atmosphere control chamber, a load lock arranged to be vertically overlapped by at least a portion of the EFEM chamber, and an EFEM arm configured to transfer the wafer carrier.

Wafer processing apparatus including equipment front end module (EFEM) and wafer processing method using the same

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Seoul, South Korea

Kongwoo Lee