Siliconware Precision Industries Co., Ltd.

Kong-Toon Ng

Chang-Fu Lin

Chee-Key Chung

Chi-Hsin Chiu

Hung-Ho Lee

Yi-Chian Liao

Bo-Hao Ma

Rui-Feng Tai

Chen-Yu Huang

Yung-Ta Li

An electronic package is provided, including: an encapsulation layer embedded with a first electronic component and conductive pillars; a circuit structure disposed on one surface of the encapsulation layer; a second electronic component disposed on the circuit structure; an insulation layer formed on the other surface of the encapsulation layer; and a circuit portion disposed on the insulation layer. Since the first and second electronic components are disposed on two sides of the circuit structure, respectively, the electronic package has various functions and high performance. A method for fabricating the electronic package is also provided.

Method for fabricating electronic package

An electronic package and a method for fabricating an electronic package are provided. An encapsulation layer encapsulates a first electronic component and a plurality of conductive pillars, and is defined with a reservation region and a removal region adjacent to the reservation region. A circuit structure is disposed on the encapsulation layer. The removal region and the circuit structure therewithin are removed for an optical communication element to protrude from a lateral surface of the encapsulation layer when the optical communication element is disposed on the circuit structure, so as to avoid a packaging material used in a subsequent process from being adhered to a protruding portion of the optical communication element.

Electronic package and method for fabricating the same

An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.

An electronic package and a method for fabricating the same are provided. The electronic package includes a stepped recess formed at a peripheral portion of a packaging module to release stress of the electronic package.

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Taichung, Taiwan

Kong-Toon Ng