Applied Materials, Inc.

Kong Lung Samuel Chan

Lara Hawrylchak

Norman L Tam

Dongming Iu

Matthew Spuller

Matthew D Scotney-Castle

Stephen Moffatt

Abhilash J Mayur

Kartik Bhupendra Shah

Aaron Jacob Miller

Elizabeth Neville

Preetham Rao

Gia Pham

Jau-Jiun Chen

Embodiments of the disclosure generally relate to a semiconductor processing chamber. In one embodiment, semiconductor processing chamber is disclosed and includes a chamber body having a bottom and a sidewall defining an interior volume, the sidewall having a substrate transfer port formed therein, and one or more absorber bodies positioned in the interior volume in a position opposite of the substrate transfer port.

Thermal chamber with improved thermal uniformity

Implementations described herein provide for thermal substrate processing apparatus including two thermal process chambers, each defining a process volume, and a substrate support disposed within each process volume. One or more remote plasma sources may be in fluid communication with the process volumes and the remote plasma sources may be configured to deliver a plasma to the process volumes. Various arrangements of remote plasma sources and chambers are described.

Plasma-enhanced anneal chamber for wafer outgassing

Showerhead for a semiconductor processing chamber

Growing community of inventors

Newark, CA, United States of America

Kong Lung Samuel Chan