Lucent Technologies Inc.

Thermalloy, Inc.

Kon Mang Lin

Ivan Pawlenko

Donald L Clemens

Larry Samson

John Robert Morris, Jr

Ralph E Stenerson, Jr

Theophilus Ifeanyi Ejim

Albert W Robinson

Quentin D Groves

A jumper cable module for use, e.g., with optical and/or electrical equipment. The module provides proper tensioning for jumper cables and retains them in a protected manner. In one embodiment, the module includes a pulley and an eccentric cam pivotally connected to a base plate. A jumper cable is wrapped around grooves in the pulley and cam such that the connectorized ends of the cable extend out and attach to the specified connection points. The cam is turned about its axle to produce the desired tension of the cable. For maintaining the tension, the cam may incorporate a tensioning mechanism, e.g., a spring-loaded ball mechanism or serrated edge ratchet. When the cable needs to be removed from the module, the tensioning mechanism is disengaged and the cam is turned to create slack in the cable for ease of cable removal. A module that includes stacks of pulleys and cams may handle multiple jumper cables. Certain modules of the present invention reduce damage to and improve handling of fiber optic jumper cables during installation and maintenance of optical communication equipment.

Jumper cable module

An improved robber or solder thieving pad, parallelogram shaped, significantly reduces solder bridging in wave soldered multi leaded through hole or surface mounted components in a printed circuit board for different wave settings. The component leads are either parallel or perpendicular to the solder wave during the soldering process. In one embodiment, the parallelogram shaped solder thieving pad is disposed contiguous or adjacent to the through hole. In another embodiment, the parallelogram shaped solder thieving pad is spaced from a thin annular ring surrounding the through-hole. In still another embodiment, the pad may be linked to the ring by a thin connecting bridge. Dimensions of the solder thieving pad vary according to the component lead size, spacing, and number of rows. The design of the pad takes into account the total molten solder volume held in a solder joint and balances the weight of the solder volume, the dynamic solder flow in the wave; and the solder surface tension for improving the drainage behavior of the solder to inhibit solder bridging of the component leads.

Solder thieving pad for wave soldered through-hole components

A clip assembly and method of attachment for a heat sink having a pin-fin array employing thermally conducting tape to secure the heat sink to a heat dissipating BGA component together with at least one clip assembly which is secured to the underside of the component at its edges.

Heat sink and attachment process for electronic components

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Pennington, NJ, United States of America

Kon Mang Lin