Mitsubishi Electric Corporation

Komaki Sasaki

Kenji Saruta

Kunihiro Tanahashi

Yuuki Tamura

A laser machining apparatus includes: an optical-scanning laser machining device that includes a machining head, which moves in a first direction and a second direction intersecting the first direction and emits laser light on a workpiece to machine the workpiece; a first marking device that is provided on one side of the optical-scanning laser machining device in the first direction and puts a mark on the workpiece; a second marking device that is provided on another side of the optical-scanning laser machining device in the first direction and puts a mark on the workpiece; and a pallet on which the workpiece to be machined by the optical-scanning laser machining device is loaded and which moves in the first direction between the first marking device and the second marking device.

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Aichi, Japan

Komaki Sasaki