Candescent Technologies Corporation

Qualcomm Mems Technologies, Inc.

Other

Qualcomm Incorporated

Netlogic Microsystems, Inc

Candescent Intellectual Property Services, Inc.

Altera Corporation

Advanced Technology Materials, Inc.

Snaptrack Incorporated

Canon Kabushiki Kaisha

Kollengode S Narayanan

Ion Bita

George B Hopple

Theodore S Fahlen

Evgeni Petrovich Gousev

Stephen P Dhanens

Christopher J Spindt

Michael James Nystrom

Roger W Barton

Shiyou Pei

Donald R Schropp, Jr

John K O'Reilly

Vasil M Chakarov

Jennifer Y Sun

Russell Wayne Gruhlke

Bob Lee Mackey

Gang Xu

Xueping Xu

Robert M Duboc

John M Macaulay

Robert G Neimeyer

Alfred S Conte

Steve T Cho

Robert L Marion

Sudhakar Gopalakrishnan

Raymond G Capek

Manish Kothari

John Keith Schneider

Hrishikesh Vijaykumar Panchawagh

Ramamoorthy Ramesh

Suryaprakash Ganti

James C Dunphy

Kostadin Dimitrov Djordjev

David William Burns

Jack Conway Kitchens

Samir Kumar Gupta

Kasra Khazeni

Marek Mienko

Timothy Dickinson

Nicholas Ian Buchan

Eugene Dantsker

Lawrence S Pan

Muhammed Ibrahim Sezan

David L Morris

Khurshid Syed Alam

Lai Wang

James Randolph Webster

John Michael Wyrwas

David R Morris

Ashish Hinger

Ying Zhou

Leonard Eugene Fennell

Nai-Kuei Kuo

Livingstone Song

Steven T Cho

Mohammad Eslamy

Masyood M Akhtar

Srikanth Chilukuru

Max Hamel

Al L Urquhart

Dmitriy Krupetskiy

Lawrence Serrano

Darrel J Guidry

Valeriy Karmanov

Robert J Lira

John P Klatt

Ron Lee Feldman

Embodiments of an ultrasonic button and methods for using the ultrasonic button are disclosed. In one embodiment, an ultrasonic button may include an ultrasonic transmitter configured to transmit an ultrasonic wave, a piezoelectric receiver layer configured to receive a reflected wave of the ultrasonic wave, a platen layer configured to protect the ultrasonic transmitter and the piezoelectric receiver layer, a first matching layer configured to match an acoustic impedance of the platen layer with an acoustic impedance of ridges of a finger, and an ultrasonic sensor array configured to detect the finger using the reflected wave.

Ultrasonic authenticating button

In one aspect, an illumination device with integrated touch sensor capability includes a light guide having a metalized light-turning feature and an electrode system for sensing changes to the capacitance between electrodes in the electrode system induced by the proximity of an electrically conductive body, such as a human finger. The metalized light-turning features may be electrically connected to and/or part of the electrode system.

Illumination device with metalized light-turning features

This disclosure relates to an interactive display, having a front surface including a viewing area, and providing an input/output interface for a user of an electronic device. A planar light guide (PLG) disposed substantially parallel to the front surface, has a periphery at least coextensive with the viewing area. A light-emitting source (LES), disposed outside the periphery of the PLG, is optically coupled with a PLG input. The PLG outputs reflected light, in a direction substantially orthogonal to the front surface, by reflecting light received from the LES. A light collecting device (LCD) collects scattered light that results from interaction of the reflected light with a user-controlled object. The LCD redirects the collected scattered light toward one or more light sensors. A processor recognizes, from outputs of the light sensors, an instance of a user gesture, and controls the interactive display and/or electronic device, responsive to the user gesture.

Full range gesture system

This disclosure provides systems, methods and apparatus for a front illumination device with metalized light-turning features. In one aspect, an illumination device with integrated touch sensor capability includes a light guide having a metalized light-turning feature and an electrode system for sensing changes to the capacitance between electrodes in the electrode system induced by the proximity of an electrically conductive body, such as a human finger. The metalized light-turning features may be electrically connected to and/or part of the electrode system.

This disclosure provides systems, methods and apparatus for a front illumination device with metalized light-turning features. In one aspect, an illumination device includes a light guide having light-turning features that include recesses formed on the light guide and that extend down into the light guide. The recesses may be coated with a material where the material also forms an auxiliary structure outside of the recesses on the light guide. The auxiliary structure may be conductive and may form, for example, an electrode.

Coated light-turning feature with auxiliary structure

A light guide device includes a light guide body and two or more pluralities of spaced-apart slits. The slits are formed by undercuts in the light guide body. Sidewalls of the slits form facets that redirect light impinging on the facets. In some embodiments, the light guide body is attached to a light source. The light source emits light that is injected into the light guide body and the slits redirect the light out of the light guide body and towards a desired target. In some embodiments, the target is a display and a first plurality of slits directs light from the light source across the light guide body and over the face of the display. A second plurality of slits then directs light out of the light guide body and towards the display.

Light turning device with prismatic light turning features

A illumination device comprises a light guide having a first end for receiving light and configured to support propagation of light along the length of the light guide. A turning microstructure is disposed on a first side of the light guide configured to turn light incident on the first side and to direct the light out a second opposite side of the light guide, wherein the turning microstructure comprises a plurality of indentations. A cover is physically coupled to the light guide and disposed over the turning microstructure. An interlayer is between the cover and the light guide, wherein the interlayer physically couples the cover to the light guide. A plurality of open regions is between the interlayer and the plurality of indentations. Various embodiments include methods of coupling the cover to the light guide while preserving open regions between the cover and plurality of indentations.

Front light devices and methods of fabrication thereof

A flat-panel display is fabricated by a process in which a spacer () having a rough face (or) is positioned between a pair of plate structure (and). When electrons strike the spacer, the roughness in the spacer's face causes the number of secondary electrons that escape the spacer to be reduced, thereby alleviating positive charge buildup on the spacer. As a result, the image produced by the display is improved. The spacer facial roughness can be achieved in various ways such as providing suitable depressions (, or) or/and protuberances (, and) along the spacer's face.

Fabrication of flat-panel display having spacer with rough face for inhibiting secondary electron escape

A semiconductor package with solder bumps and a method for making the same are described. One embodiment comprises a flip-chip design with a rectangular semiconductor die with a relatively large aspect ratio bonded to a substantially square substrate through solder bumps. In one embodiment, active bumps are concentrated in an area relatively close to the neutral point of the die, for example, in a substantially square area about the neutral point.

Method for fabricating integrated circuit package with solder bumps

The present invention provides a spacer assembly which is tailored to provide a secondary electron emission coefficient of approximately 1 for the spacer assembly when the spacer assembly is subjected to flat panel display operating voltages. The present invention further provides a spacer assembly which accomplishes the above achievement and which does not degrade severely when subjected to electron bombardment. The present invention further provides a spacer assembly which accomplishes both of the above-listed achievements and which does not significantly contribute to contamination of the vacuum environment of the flat panel display or be susceptible to contamination that may evolve within the tube. Specifically, in one embodiment, the present invention is comprised of a spacer structure which has a specific secondary electron emission coefficient function associated therewith. The material comprising the spacer structure is tailored to provide a secondary electron emission coefficient of approximately 1 for the spacer assembly when the spacer assembly is subjected to flat panel display operating voltages.

Tailored spacer wall coatings for reduced secondary electron emission

Integrated circuit package with solder bumps

A flat-panel display contains a pair of plate structure ( and ) separated by a spacer ( ) having a rough face ( or ). When electrons strike the spacer, the roughness in the spacer's face causes the number of secondary electrons that escape the spacer to be reduced, thereby alleviating positive charge buildup on the spacer. As a result, the image produced by the display is improved. The spacer facial roughness can be achieved in various ways such as depressions ( , or ) or/and protuberances ( , and ). Various techniques are presented for manufacturing the display, including the rough-faced spacer.

Flat-panel display having spacer with rough face for inhibiting secondary electron escape

The present invention provides a method of forming solder bumps on a semiconductor chip, for flip-chip bonding, having increased height to improve the solder joint reliability of the flip-chip bonded chip and carrier assembly. According to the present invention, a second layer of solder structure is deposited on to each of the solder bump precursor structures formed by a first layer of solder structure to increase the solder-bump volume, which results in solder bumps with increased height.

Increased solder-bump height for improved flip-chip bonding and reliability

Methods and structures are provided which support spacer walls in a position which facilitates installation of the spacer walls between a faceplate structure and a backplate structure of a flat panel display. In one embodiment, spacer feet are formed at opposing ends of the spacer wall. These spacer feet can be formed of materials such as ceramic, glass and/or glass frit. The spacer feet support the corresponding spacer wall on the faceplate (or backplate) structure. Tacking electrodes can be provided on the faceplate (or backplate) structure to assert an electrostatic force on the spacer feet, thereby holding the spacer feet in place during installation of the spacer wall. The spacer wall can be mechanically and/or thermally expanded prior to attaching both ends of the spacer wall to the faceplate (or backplate) structure. The spacer wall is then allowed to contract, thereby introducing tension into the spacer wall which tends to straighten any inherent waviness in the spacer wall. Alternatively, spacer clips can be clamped onto opposing ends of a spacer wall to support the spacer wall during installation. The spacer clips can provide electrical connections to face electrodes located on the spacer wall.

Self-standing spacer wall structures and methods of fabricating and installing same

Growing community of inventors

Cupertino, CA, United States of America

Kollengode S Narayanan