Sumitomo Electric Industries, Limited

Sumitomo Wiring Systems, Limited

Autonetworks Technologies, Limited

Koki Uchida

Yukinori Kita

Arinobu Nakamura

Jun Ikeda

Munsoku O

Shun Takamizawa

An in-vehicle backup power supply device includes a battery unit having a plurality of unit batteries connected in series and a discharge circuit configured to perform a first discharge operation for supplying power to a third conductive path based on a charge accumulated in the battery unit, a balance circuit performs a cell balancing operation on the battery unit, and a control unit controls the balance circuit, and the balance circuit is performs a second discharge operation for supplying power to the third conductive path based on a charge accumulated in a plurality of power storage elements, and the control unit performs a first control for causing the balance circuit to perform the cell balancing operation and a second control for causing the balance circuit to perform the second discharge operation, and if a failure in which the first discharge operation cannot operate normally occurs, performs the second control.

In-vehicle backup power supply device

A metal member-equipped circuit boardincludes: a printed circuit boardincluding a through hole; a metal memberincluding a shaft portionthat is inserted into the through hole, and a head portionthat is arranged outside the through hole, the head portionhaving a diameter larger than a diameter Aof the through hole, and a conductive bonding materialfor bonding the shaft portionand an inner wall of the through holeto each other.

Metal member-equipped circuit board, circuit assembly, and electrical junction box

Provided is a substrate unit including a case accommodating a circuit board; a bus bar electrically connected to the circuit board, and includes an extending portion extending out of the case; and an external thread portion for electrically connecting the extending portion to a connection terminal of a wire harness, the external thread portion including a shaft portion with an external thread, and a head portion that is noncircular, and protrudes at one end portion of the shaft portion in a radial direction of the shaft portion, wherein the case includes a fitting recess to which the head portion is fitted by sliding the external thread portion in a direction intersecting an axial direction of the external thread portion, and that has an abutment surface by which the head portion is stopped, and, at least on the two sides of the abutment surface, relief recesses that define a gap.

Substrate unit

A circuit assembly includes: a substrate formed with a ground pattern and a through-hole; a metal member that is inserted into the through-hole and electrically connected to the ground pattern; a heat dissipation member made of metal, that is overlaid on the substrate and can be connected to an external ground potential; and conductive paste that connects the metal member and the heat dissipation member.

Circuit assembly and electrical junction box

A circuit assembly includes a busbar substrate with busbars and a resin part that is in intimate contact with the busbars, a press-fit member that is made of metal with a thickness greater than the thickness of the busbars, and is press-fitted in the busbar substrate, an electronic component connected to the press-fit member, solder that connects the busbars and the press-fit member, and a solder accumulating portion that is formed with the resin part, and in which the solder is accumulated.

A substrate unit includes a circuit board; a connector portion mounted on the circuit board; and a case that contains the circuit board. The case includes a lower case having an accommodation section opened upward and accommodating the circuit board. An upper cover covers the accommodation section of the lower case. An aperture is opened in a side wall of the case, allowing the connector portion to be fitted to a counterpart connector portion. The upper cover includes a ceiling portion having a board opposing region that opposes the circuit board accommodated in the accommodation section and an outer region is located outside of the board opposing region without opposing the circuit board; and guide grooves inclined from the board opposing region to the outer region. The guide grooves discharging the water droplets away from the circuit board.

The present disclosure provides a board unit including: a circuit board; a connector portion that is mounted on the circuit board; and a case that houses the circuit board. The case includes: a lower case that has an upper opening; an upper cover that covers the upper opening of the lower case; and an opening portion that is formed in a side wall of the case so as to allow the connector portion to be fitted to a mating connector portion. The side wall includes: a step surface that extends outward from a lower region of the opening portion; and a plurality of vertical groove portions whose first ends are connected to the step surface and whose second ends are connected to a lower edge of the side wall.

Board unit

A board unit includes a case accommodating a circuit board. A power terminal connects a lead-out part of a bus bar with a connection terminal of an electric wire. A cover covers the power terminal and has a lateral wall overlapping a peripheral wall part. The lateral surface of the peripheral wall part and the lateral wall includes an engagement protrusion and an engagement recess to be engaged with the engagement protrusion. The lateral wall of the cover includes a latch piece at a position offset from the engagement protrusion or the engagement recess in a longitudinal direction and a latch portion to be latched with the latch piece which restricts displacement of the lateral wall of the cover in a direction away from the lateral surface of the peripheral wall part of the case.

A circuit assembly that includes a heat generator; a circuit board, which has a conduction path, and to which the heat generator is mounted, a heat dissipating member arranged facing the circuit board, an insulating film arranged in a region that is overlapped by the heat generator between the circuit board and the heat dissipating member, an adhesive or sticky first heat conductor that is arranged between the circuit board and the insulating film and is in contact with the circuit board and the insulating film, and an adhesive or sticky second heat conductor that is arranged between the insulating film and the heat dissipating member and is in contact with the insulating film and the heat dissipating member.

Growing community of inventors

Mie, Japan

Koki Uchida