Tokyo Ohka Kogyo Co., Ltd.

Koki Tamura

Hirofumi Imai

Takahiro Yoshioka

Atsushi Kubo

Takahiro Asai

Yoshihiro Inao

Yasushi Fujii

Daisuke Kawana

Tomotaka Yamada

Takayuki Hosono

Koichi Misumi

Atsushi Matsushita

Yasumasa Iwata

Shingo Ishida

Mitsuru Sato

Kazumasa Wakiya

Masaaki Yoshida

Toshiyuki Ogata

Taku Hirayama

Atsushi Miyanari

Shigeru Yokoi

Tomoyuki Ando

Ryoichi Takasu

Hiroshi Shimbori

Takuma Hasegawa

Atsuo Kajima

An adhesive composition contains (a) a resin consisting of (i) a block copolymer or (ii) 35% by weight or greater and less than 100% of the block copolymer and 65% by weight or less of a random copolymer, the block copolymer having a weight average molecular weight in a range of 50,000 to 150,000, wherein the block copolymer is a diblock copolymer, a triblock copolymer, or a combination thereof, and includes a styrene group, both terminals of a main chain of the triblock copolymer are styrene groups; (b) a solvent which includes a condensed polycyclic hydrocarbon, wherein an adhesive layer formed by using the adhesive composition has a Young's modulus of 0.1 GPa or greater at 23&#xb0; C., a storage modulus (G') of 1.5&#xd7;10Pa or less at 220&#xb0; C., and a loss factor (tan &#x3c3;) of 1.3 or less at 220&#xb0; C.; and (c) a thermal polymerization inhibitor.

Adhesive composition, adhesive film, and bonding method

A laminate is formed by laminating a substrate and a support plate through an adhesive layer and a release layer. The release layer is formed by applying a composition containing a reactive polysilsesquioxane and a crosslinkable group-containing siloxane onto the surface of the support plate or the surface of the substrate and heating the composition to polymerize the reactive polysilsesquioxane and the crosslinkable group-containing siloxane.

Composition for forming release layer, release layer, laminate including release layer, method of preparing laminate, and method of treating laminate

An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, including a thermoplastic resin and a release agent.

Adhesive composition, laminate, and stripping method

A laminate including a supporting member which is light transmissive; a supported substrate which is supported by the supporting member; an adhesive layer which is provided on a surface of the supported substrate on which surface the supported substrate is supported by the supporting member; and a release layer, which (i) is provided between the supporting member and the supported substrate and (ii) contains a polymer including, in a repeating unit, a structure having a light absorption property, a property of the polymer being changed when the polymer absorbs light irradiated via the supporting member.

Laminated body and method for separating laminated body

An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, and includes a thermoplastic resin and a release agent.

A laminate including a supporting member which is light transmissive; a supported substrate supported by the supporting member; an adhesive layer provided on a surface of the supported substrate which surface faces toward the supporting member; and a release layer which is made of an inorganic material and is provided between the supporting member and the supported substrate, the release layer having a property that changes when the release layer absorbs light coming through the supporting layer, and the release layer having a flat surface which faces the adhesive layer.

Laminate and method for separating the same

A bonding method including an adhesive layer forming process in which a thermoplastic adhesive is applied to a substrate or a support plate and an adhesive layer is formed; a heating process in which the adhesive layer that is formed on the substrate or the support plate is heated; and a bonding process in which the substrate and the support plate are pressed against each other via the heated adhesive layer, thereby bonding the substrate and the support plate.

Processing method and processing apparatus

A laminate including a supporter which transmits infrared; a substrate supported by the supporter; an adhesive layer via which the supporter and the substrate are attached to each other; and a separation layer positioned on a surface of the supporter to which surface the substrate is attached, and which is made of a compound having an infrared-absorbing structure. A target is tightly attached and supported in the laminate while securing easy separation of a supporter from the target.

An adhesive composition of this invention includes a hydrocarbon resin and a solvent for dissolving the hydrocarbon resin, the solvent containing a condensed polycyclic hydrocarbon. Thus, an adhesive composition having excellent product stability is provided.

Adhesive composition

A method for supporting a support to which a wafer is attached, by supporting the support against gravitational force by supporting three or more support points of an inner circumference section of a support surface of the support. The support surface of the support is opposite to a side on which the wafer is attached to the support.

Support method, high-temperature treatment method using same, and support jig

A laminate including a supporting member which is light transmissive; a supported substrate supported by the supporting member; an adhesive layer provided on a surface of the supported substrate which surface faces toward the supporting member; and a release layer which is made of a fluorocarbon and is provided between the supporting member and the supported substrate, the release layer having a property that changes when it absorbs light coming through the supporting member.

A processed substrate and a method for easily manufacturing the processed substrate with high efficiency are provided, the processed substrate having openings in respective surfaces thereof that are matched to each other in size. The processed substrate includes a light transmissive substrate having a plurality of through-holes. Each of the through-holes has a large-diameter opening and a small-diameter opening, the large-diameter opening being larger in size than the small-diameter opening by 5% or less of the size of the large-diameter opening. As such, through-holes with openings in the respective surfaces of the processed substrate that are matched to each other in size can be provided.

Processed substrate and method for manufacturing same

Disclosed is an adhesive composition in which a solid component is dissolved in a solvent, the solid component being dissolved in the solvent to have a solid component content of not less than 20% by weight with respect to a total amount of the solid component and the solvent, the solid component containing resin obtained by polymerizing a monomer composition that contains a cycloolefin monomer, the solvent having no carbon-carbon double bond, and an alcohol content contained in the solvent being not more than 0.45% by weight with respect to an entire amount of the solvent.

An adhesive composition including a hydrocarbon resin, a modified elastomer that is bonded with at least one functional group-containing atom group, and a solvent.

Adhesive composition, adhesive film, and method for treating substrate

The adhesive composition according to the present invention includes a resin containing a polymer having an alkoxystyrene structure as a repeating unit, and an acid generator. In accordance with the present invention, it is possible to provide a novel adhesive composition which is excellent in heat resistance and which is easily stripped.

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Kawasaki, Japan

Koki Tamura