Shinko Electric Industries Co., Ltd.

Nippon Tungsten Co., Ltd.

Japan Fine Ceramics Center

Philtech Inc.

Trek Holding Co., Ltd.

Koki Tamagawa

Tadayoshi Yoshikawa

Miki Saito

Norio Shiraiwa

Hiroshi Yonekura

Naoto Watanabe

Tomoaki Koyama

Yuji Furumura

Naomi Mura

Mitsuyoshi Nagano

Toshio Uehara

Jiro Kawai

Hideaki Matsubara

Kouta Tsutsumi

Tetsushi Matsuda

A tray includes a support base having both a first face on which a clamp object is placed and a second face opposite the first face, an upper electrode embedded in the support base and situated toward the first face, a lower electrode embedded in the support base and situated further toward the second face than the upper electrode is, and one or more interconnect lines configured to provide an electrical connection between the upper electrode and the lower electrode.

Tray and wafer holding apparatus

An electrostatic chuck apparatus includes a pedestal part including a side surface, an electrostatic chuck including a side surface and provided on the pedestal part, an adhesive part including a side surface and provided between the pedestal part and the electrostatic chuck, the adhesive part containing a resin adhesive agent that adheres the pedestal part and the electrostatic chuck together, a recess part provided in a portion of the side surface of the pedestal part and a portion of the side surface of the electrostatic chuck, the recess part being provided in an area that includes a side surface of the adhesive part, the recess part being provided along an outer periphery of the pedestal part, an outer periphery of the adhesive part, and an outer periphery of the electrostatic chuck, and a focus ring engaged with the recess part and covering the side surface of the adhesive part.

Electrostatic chuck apparatus

A dielectric layer for an electrostatic chuck is formed of a ceramic material having a first phase including aluminum oxide and a second phase including composite carbonitride (Ti, Me)(C, N) that contains titanium as fine grains. The Me represents a transition element and metals of Group 4 to Group 6 such as Mo and W. The ceramic material that includes the second phase by 0.05 vol % to 2.5 vol % has a volume resistivity value of about 10to 10(&#x3a9;&#xb7;cm) necessary for a Johnsen-Rahbek type electrostatic chuck.

Dielectric layer for electrostatic chuck and electrostatic chuck

A substrate including a sensor unit, wherein the sensor unit includes a coil wound at least once arranged on the surface of the sensor or embedded within and near the surface thereof. With such an arrangement, an electric current that corresponds to information with respect to the substrate (e.g., the temperature of the substrate or the amount of charge stored in the substrate) flows through the coil.

Substrate, substrate holding apparatus, analysis apparatus, program, detection system, semiconductor device, display apparatus, and semiconductor manufacturing apparatus

A substrate temperature regulation fixed apparatus has a base substance on which a vacuumed object is placed, an adhesive layer and a base plate. The base substance is fixed on the base plate through the adhesive layer. The adhesive layer contains a substance having plasma resistance.

Substrate temperature regulation fixed apparatus

A substrate temperature control fixing apparatus comprises an electrostatic chuck which includes a base body and adsorbs and holds an adsorbing target mounted on one of surfaces of the base body, a base plate which supports the electrostatic chuck, and a bank portion provided on an outer periphery of one of surfaces of the base plate which is opposed to the other of the surfaces of the base body.

Substrate temperature control fixing apparatus

An electrostatic chuck includes a metal base member and an insulating substrate having an opposite surface to an attraction surface joined onto the base member via an adhesive layer. In the substrate, an electrode layer to which a direct current voltage for attraction is applied is embedded in a portion of the substrate, close to the attraction surface. In addition, a plurality of independent RF electrode layers to which different radio frequencies for plasma control are fed, respectively, are embedded in portions of the substrate, at an opposite side of the first electrode layer to the attraction surface. The RF electrode layers are arranged separately in different layers which are not on an identical plane in such a manner as to partially overlap each other in a plan view.

Substrate for electrostatic chuck and electrostatic chuck

There is provided an electrostatic chuck for placing an adsorption object or a base body having an electrostatic electrode embedded therein and generating a coulombic force between the adsorption object and the electrostatic electrode by applying a voltage to the electrostatic electrode so as to hold the adsorption object in an adsorption state, wherein the base body includes a upper surface of the base body opposed to the adsorption object and a protrusion portion provided in the upper surface of the base body so as to come into contact with the adsorption object, and wherein the protrusion portion is provided in a region except for an outer edge portion of the upper surface of the base body, and the outer edge portion is substantially formed in the same plane as that of the upper surface of the base body.

Electrostatic chuck and substrate temperature adjusting-fixing device

There is provided an apparatus including: an electrostatic chuck for holding an object; and a base plate which supports the electrostatic chuck and controls a temperature of the electrostatic chuck. The electrostatic chuck is fixed onto the base plate via an adhesive layer. The electrostatic chuck includes: a base; an electrostatic electrode built in the base; and a mounting portion containing a dielectric material and detachably mounted on the base. The object is mounted on the mounting portion.

Electrostatic chuck and substrate temperature control fixing apparatus

An electrostatic chuck includes a dielectric layerformed with an attraction and fix face onto which a plate memberis attracted and fixed, wherein the attraction and fix face of the dielectric layeris formed with a plurality of projection partseach with only a tip face abutting the plate memberformed as a flat face by grinding and formed with a coolant gas flow pathwhere a coolant gas flows is opened to the flat face of each of the projection parts

Growing community of inventors

Nagano, Japan

Koki Tamagawa