Murata Manufacturing Co., Ltd.

Koki Sai

Toru Kizu

Isao Ikeda

Shigeo Ojima

Kazuhiro Mimura

Tadashi Yoda

Hiroshi Kumano

A method for manufacturing a ceramic substrate that includes forming a mother multilayer body by positioning a hole in at least one ceramic green sheet among a plurality of laminated ceramic green sheets in a location that does not overlap with a recess formation-planned region in which a recess is to be formed after firing of the mother multilayer body and that overlaps with a singulation-planned line for singulating the mother multilayer body into pieces after firing; and forming the recess in the mother multilayer body before firing by performing press working on the recess formation-planned region of the mother multilayer body.

Method for manufacturing ceramic substrate and ceramic substrate

A vibrator, a vibrating element and a method for producing the vibrating element may include vibrating piece having a central portion and a peripheral portion. The vibrator, the vibrating element and the method may further include a pair of excitation electrodes provided on a first side and a second side of a main surface of the central portion. The vibrator, the vibrating element and the method may further include a pair of connection electrodes provided on the peripheral portion and electrically connected to the pair of excitation electrodes. The vibrator, the vibrating element and the method may further include a substrate configured to be connected to the pair of connection electrodes via an electrically-conductive holding member interposed therebetween and configured to support the vibration element in an excitable manner.

Vibration element, vibrator, and method for producing vibration element with a vibrating piece having a protruding part for improved vibration characteristics

A method for manufacturing a ceramic substrate that includes forming a mother multilayer body by laminating a ceramic green sheet on a shrinkage suppressing green sheet, the shrinkage suppressing green sheet having a planar shrinkage rate in firing smaller than a planar shrinkage rate in firing of the ceramic green sheet; and forming a recessed portion in the mother multilayer body before firing by pressing a recessed portion formation planned region where the recessed portion is to be formed after firing of the mother multilayer body.

An electronic device that includes a base substrate having a mounting surface; an electronic component having a mechanical vibration portion mounted on the mounting surface of the base substrate; an intermediate layer mounted on the base substrate and forming an internal space with the base substrate so as to accommodate the electronic component therein, the intermediate layer having at least one through-hole that opens the internal space to an outside; and a sealing layer on the intermediate layer and sealing the internal space by closing the at least one through-hole.

Electronic device and manufacturing method therefor

A piezoelectric substrate manufacturing device that includes first and electrodes that face each other with a piezoelectric substrate interposed therebetween; a cover that surrounds the second electrode such that the leading end of the second electrode is exposed; a supply unit that supplies a processing gas to an internal space of the cover; a processing unit that performs surface processing on the piezoelectric substrate by applying a voltage between the first and second electrodes causing the processing gas to change into plasma; a detector that is provided outside the cover with its relative position fixed with respect to the second electrode; a measurement unit that measures the thickness of the piezoelectric substrate using the detector; a driving unit that changes the relative positions of the first and second electrodes; and a control unit that controls the supply unit, the processing unit, the measurement unit, and the driving unit.

Piezoelectric substrate manufacturing device and piezoelectric substrate manufacturing method

A quartz crystal resonator that includes an AT-cut quartz crystal blank including a first main surface and a second main surface that face each other and each of which has long sides extending in an X-axis direction of the quartz crystal blank and short sides extending in a Z'-axis direction of the quartz crystal blank, and a first side surface and a second side surface that are located adjacent to the long sides of the first main surface and the second main surface; a first excitation electrode and a second excitation electrode; and an extension electrode that extends from the first main surface to the second main surface along the first side surface and that is electrically connected to the first excitation electrode. Each the first and second side surfaces have a first m-plane face and a second m-plane face.

Quartz crystal resonator, quartz crystal resonator unit, and method of manufacturing quartz crystal resonator

A quartz crystal resonator that includes a substrate including a vibration portion, a frame portion that surrounds the vibration portion, and first to fourth coupling portions that couple the vibration portion and the frame portion to each other; and first and second excitation electrodes. An intersecting point of diagonal lines of a quadrangle formed by first to fourth connection portions is located on the positive side of the z axis relative to the x axis.

Quartz crystal resonator and quartz crystal resonator unit

A method for manufacturing a quartz crystal resonator that includes a quartz crystal blank having a vibrating portion including a center of a principal surface of the quartz crystal blank when viewed in plan from a direction normal to the principal surface and a peripheral portion adjacent to the vibrating portion, a pair of excitation electrodes disposed opposite to each other with the vibrating portion interposed therebetween, a pair of electrode pads disposed on the peripheral portion, and a pair of extended electrodes each extending from the vibrating portion to the peripheral portion to electrically connect one excitation electrode to a corresponding electrode pad, where the method includes conducting a first trimming of the vibrating portion and the peripheral portion; and conducting a second trimming of part of one of the excitation electrodes on the vibrating portion.

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Nagaokakyo, Japan

Koki Sai