Tmeic Corporation

Toshiba Mitsubishi-Electric Industrial Systems Corporation

Koki Nakamura

Toshihide Nakano

Toshiki Nakamori

Kenji Suzuki

Ryohei Kozu

A rack includes first to fourth column members and first and second guide members. A case of an electric device has first and second side surfaces in a width direction that are supported by the first and second guide members, respectively. First and second restriction members are attached to inner surfaces of the first and second side surfaces of the case, respectively, for restricting the case from moving in a front direction of the rack. Second restriction member is attached to face the first restriction member in the width direction. In a state where the electric device is housed within the rack, the first restriction member is located between the first and third column members in a front-back direction. The second restriction member is located between the second and fourth column members in the front-back direction.

Electric apparatus and electric device

A fan unit is disposed on an upper surface of a housing, and includes a fan, a frame member, and a support member. The frame member is disposed to surround an outer circumference of an opening provided in an upper surface of the housing. The support member supports the fan above the opening while being fixed to the frame member. A gap is provided between a lower end of a first surface of the frame member and the upper surface of the housing. A first blocking member is connected to the first surface of the frame member to be slidable in a vertical direction. In a state in which the gap is exposed, at least one second blocking member is inserted through the gap into the frame member to block the opening in the upper surface of the housing.

Uninterruptible power supply device and uninterruptible power supply system

A partition member is disposed in a space portion between a rear surface of a housing and outer surfaces of a plurality of units. A first partition portion is disposed in a boundary portion between two units adjacent to each other in a vertical direction and extends in a right-left direction. A second partition portion and a third partition portion each are connected to a corresponding one of both ends of the first partition portion in the right-left direction and extend toward the upper surface. Air discharged from a first unit group located above the first partition portion is guided to flow through a first air channel to the upper surface. Air discharged from a second unit group located below the first partition portion is guided to flow through a second air channel to the upper surface.

Power conversion device

An uninterruptible power supply device includes a housing having a rectangular parallelepiped shape, a plurality of units vertically stacked and accommodated in housing, and a fan unit having a plurality of fans aligned on an upper surface of housing. Each of the upper surface and the lower surface of housing is formed with an opening through which a wire is led into housing.

Uninterruptible power supply device

A power conversion unit includes a plurality of semiconductor modules, a gate drive circuit, a first substrate having a flat plate shape, and a second substrate having a flat plate shape. The first substrate has a first surface facing a bottom plate of a casing accommodating the semiconductor modules and the gate drive circuit, and a second surface on an opposite side to the first surface. The second substrate is arranged above the first substrate in parallel with the second surface. The semiconductor modules are mounted on the first surface. The gate drive circuit is formed on a surface of the second substrate on a side that does not face the second surface. The power conversion unit further includes a connector provided on the second surface and connected to a surface on a side facing the second substrate.

Power conversion unit

The semiconductor device according to the present invention includes a semiconductor module, a cooling member, and a heat transfer member. The semiconductor module includes a switching element and a diode connected in antiparallel to each other. The heat transfer member is disposed between the semiconductor module and the cooling member so as to transfer heat generated by the switching element and the diode to the cooling member. The heat transfer member has a mounting surface on which the switching element and the diode are mounted side by side and a surface which is opposite to the mounting surface and is disposed in contact with the cooling member. In the heat transfer member, the thermal conductivity in a first direction parallel to the mounting surface is higher than the thermal conductivity in a second direction perpendicular to the mounting surface.

Growing community of inventors

Chuo-ku, Japan

Koki Nakamura