Nichia Corporation

Shin-Etsu Chemical Co., Ltd.

Koki Matsumoto

Kunihito Sugimoto

Toshio Shiobara

Masato Ono

Tsutomu Kashiwagi

Masanobu Sato

Hideyuki Kanno

A method of reducing surface tackiness of a silicone rubber cured product is provided. The method includes coating the surface of a cured product of a curable silicone rubber composition, which has a molar ratio within the composition of hydrogen atoms bonded to silicon atoms relative to alkenyl groups bonded to silicon atoms of 1.0 or greater, and which, following curing, exhibits a type A hardness prescribed in JIS K6253 of no more than 20, with a curable silicone resin layer which, following curing, exhibits a type D hardness prescribed in JIS K6253 of 30 or greater; and subsequently curing the silicone resin to form a cured resin layer with a thickness of no more than 0.5 mm. Adhesion of dirt to the surface can be prevented.

Method of reducing surface tackiness of silicone rubber cured product, liquid silicone rubber composition for sealing semiconductor, silicone rubber-sealed semiconductor device, and method of producing semiconductor device

The semiconductor device includes a support substrateon which a semiconductor elementto be mounted, a covering memberdisposed to the support substrate via a bonding member, and a spaceis defined between the covering memberand the support substrate. The support substratehas a protruded portionand the covering memberis disposed so that a portion thereof is in contact with the protruded portionso as to define an air vent leading from the spaceto outside.

Semiconductor light emitting device

A semiconductor device comprises a support member having a pair of first conductive materials and a pair of second conductive materials on an insulating substrate, and a sealing member covering a semiconductor element arranged on the support member, wherein the support member has an insulating portion where the insulating substrate is exposed between the pair of the first conductive materials, and at least one of the pair of the second conductive materials is arranged along the side of the insulating portion, and the sealing member is disposed so that the sealing member is over at least a part of at least one of the first conductive materials and the second conductive materials.

Support member for mounting a semiconductor device, conductive materials, and its manufacturing method

Light emitting diode

Growing community of inventors

Komatsushima, Japan

Koki Matsumoto