Renesas Electronics Corporation

Hitachi Cable, Inc.

Nec Corporation

Nec Electronics Corporation

Nec Compound Semiconductor Devices, Ltd.

Other

Nitto-denko Corporation

Koki Hirasawa

Kenji Uchida

Akira Chinda

Nobuaki Miyamoto

Teruo Ono

Mamoru Mita

Sachio Suzuki

Shinya Ota

Tatsuya Ohtaka

Katsumi Shimada

Shinjiro Uenishi

Hiroyuki Kimura

Kazuhisa Kishino

Taibo Nakazawa

Shingo Yanagihara

A method for manufacturing an electronic device includes forming a resin film over a wafer, the wafer including a plurality of elements formed therein, each of the elements including a functional unit, patterning the resin film to form a plurality of frame members, each of the frame members being provided on each of the elements and surrounding the functional unit, dividing the wafer into the elements, and providing an encapsulation.

Electronic device and method for manufacturing electronic device

The electronic device, which allows inhibiting the breaking-away of the element from the frame member, even if the temperature change of the electronic device is repeated, and the process for manufacturing the electronic device, are achieved. An electronic device includes a photo-sensitive element formed in a wafer, a frame member installed on the wafer to surround a functional unit, and an encapsulating resin layer filling a circumference of the frame member.

Electronic device and process for manufacturing electronic device

An electronic device is provided with an improved reliability and a reduced contamination in a functional unit of an exposed element, and a method for manufacturing thereof is also provided. An electronic device includes a light receiving element, a frame member composed of a first resin provided so as to surround a photo acceptor unit of the light receiving element, and an encapsulating resin layer composed of a second resin and filling a periphery of the frame member. The photo acceptor unit of the light receiving element is exposed in a space surrounded by the frame member. The upper surface of the frame member and the upper surface of the encapsulating resin layer form a common plane, or the upper surface of the frame member is higher than the upper surface of the encapsulating resin layer.

An electronic device capable of balancing both light transmitting and receiving performance and mounting reliability is provided. The electronic device includes an element (light receiving element), a transparent layer, and a sealing resin layer. The element is, for example, a semiconductor element and has an optically functional region having an optical function (for example, light receiving or light emission) on one face. The transparent layer is located on the optically functional region, directly comes in contact with the one face of the light receiving element, and is optically transparent. The sealing resin layer seals sides of the transparent layer and one face of the light receiving element, does not coat an upper face of the transparent layer, and is mixed with filler that improves rigidity.

Electronic device and method of manufacturing the electronic device

An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to surround the metal electrode.

Method for fabricating an electronic device substrate

A method of making an electronic device is disclosed. The method includes the steps of providing an electronic device substrate, mounting an electronic part on the electronic device substrate, removing the tape member and the metal film from the electronic device substrate, and forming a conductive structure at a position corresponding to the metal plating layer. The electronic device substrate includes a base material formed of a thin board and the base material includes a tape member, a metal film, a release layer, a metal layer, an electrical insulation layer and a metal plating layer filled in the plurality of openings.

Method of making an electronic device and electronic device substrate

Electronic device substrate and its fabrication method, and electronic device and its fabrication method

A method of manufacturing a semiconductor device includes: forming a first resin layer on a wafer having a light receiving portion; patterning the first resin layer into a predetermined shape and forming a first resin film on the light receiving portion; dividing the wafer into light receiving elements; mounting the light receiving elements on an upper surface of a lead frame; a sealing step of forming a sealing resin layer around the first resin film; and removing the first resin film such that a portion of the light receiving element is exposed to the outside, and in the sealing step, the upper surface of the first resin film is flush with the upper surface of the sealing resin layer, or the upper surface of the first resin film is higher than the upper surface of the sealing resin layer.

Method of manufacturing semiconductor device in which functional portion of element is exposed

A core substrate-less electronic device is fabricated by using an electronic device substrate. The electronic device substratea metal core substrate, and an external connection wiring layerprovided on the metal core substrate, and an electronic parts-mounting layerprovided on the external connection wiring layer. The external connection wiring layerhas a first plating filmas an external connection terminal, and a PSR filmas an electrical insulating material. The electronic parts-mounting layerhas a conductive filmas an internal conductor pattern and a PSR filmas an electrical insulating material. A surface of the conductive filmis in a same plane as a surface of the PSR film

Electronic device substrate, electronic device and methods for fabricating the same

An electronic device substrate having: a base material formed of a thin board; an electrical insulation layer formed on the base material and having plural openings in a thickness direction thereof; and a metal plating layer filled in the plural openings. The base material has a metal layer, a release layer formed contacting the metal layer, and a metal film formed contacting the release layer.

Electronic device substrate, electronic device and methods for making same

In an optical semiconductor integrated circuit device using a lead frame, a transparent epoxy resin composition for molding an optical semiconductor contains (A) an epoxy resin; (B) a curing agent; (C) a thiol; and (D) an amine-based curing catalyst represented by following Chemical Formula 1: 

Transparent epoxy resin composition for molding optical semiconductor and optical semiconductor integrated circuit device using the same

An electronic device substrate is formed of a thin-plate reinforcing substrate; an external connection wiring layer stacked on the reinforcing substrate, and comprising an electrical insulation provided on the reinforcing substrate, an opening formed in the electrical insulation, a first conductor pattern and a via-hole conductor provided in the opening and formed integrally with each other; and a second conductor pattern formed on the opposite side of the electrical insulation to the reinforcing substrate, and at least partially electrically connected to the via-hole conductor.

A lead frame of the present invention includes a plurality of tie bars including tie bars each having deformable portions that protect opposite outside frames from deformation. The outside frames each are formed with positioning holes. Element loading portions to be loaded with semiconductor elements are connected to the outside frames by such tie bars. The lead frame is therefore free from deformation during lead forming while promoting the miniaturization of the semiconductor devices.

Lead frame, semiconductor device produced by using the same and method of producing the semiconductor device

A recess for fully receiving an electronic component and a window opened from the bottom of the recess to the bottom surface of a metal substrate are formed in the metal substrate. A wiring board is bonded to the underside of the metal substrate, and the electronic component is fixed to the bottom of the recess. Input and output terminals of the electronic component are connected to electrode pads of the wiring board exposed within the window using wire bonding. A metal lid is bonded to the top surface of the metal substrate to close the opening of the recess. Electromagnetic waves generated by the electronic component are confined to the electronic device because the electronic device is surrounded by the metal substrate, the metal lid, and a ground electrode disposed on the wiring board. Heat dissipation performance is assured because the electronic component is connected to the metal substrate.

Growing community of inventors

Kawasaki, Japan

Koki Hirasawa