Ngk Insulators, Inc.

Osaka University

Koki Chiba

Naokuni Muramatsu

Tetsuo Sakai

Taku Sakai

Yumiko Kasuya

Naoki Yamagami

There is provided a copper alloy composed of Ni: 5 to 25% by weight, Sn: 5 to 10% by weight, at least one element M selected from the group consisting of Zr, Ti, Fe, and Si: 0.01 to 0.30% by weight in total, at least one element A selected from the group consisting of Mn, Zn, Mg, Ca, Al, and P: 0.01 to 1.00% by weight in total, the balance being Cu and inevitable impurities. Ni-based intermetallic compound grains containing a Ni-M intermetallic compound are formed in the copper alloy. The number of the Ni-based intermetallic compound grains present per unit area of 1 mmin the copper alloy is 1.0×10to 1.0×10.

Copper alloy and method for producing same

A copper base rolled alloy has a copper base alloy composition containing 0.05 percent by mass or more, and 10 percent by mass or less of at least one type of element selected from Be, Mg, Al, Si, P, Ti, Cr, Mn, Fe, Co, Ni, Zr and Sn, wherein the X-ray diffraction intensity ratio I(111)/I(200) where I(hkl) is the X-ray diffraction intensity from (hkl)plane measured with respect to a rolled surface is 2.0 or more.

Copper base rolled alloy and manufacturing method therefor

A method for producing beryllium-copper containing at least Be and Cu, includes holding the beryllium-copper for a predetermined solid solution time in a solid solution temperature range in which the Be is dissolved into the Cu, cooling the beryllium-copper at a cooling speed at which the Be remains dissolved in the Cu, applying plastic strain to a cooled beryllium-copper over multiple times in a processing temperature range in which the Be is not precipitated, and holding the beryllium-copper for a predetermined age hardening time in a precipitation temperature range in which the Be is precipitated.

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Kawaguchi, Japan

Koki Chiba