Globalfoundies Inc.

Kok-Yong Yiang

Paul Raymond Besser

Richard C Blish

Christy M-c Woo

Christine Hau-Riege

Jun “Charlie” Zhai

The peeling stress between a Cu line and a capping layer thereon, after via patterning, is reduced by varying the shape of the via and positioning the via to increase the space between the via and the line edge, thereby increasing electromigration lifetime. Embodiments include varying the shape of the via, as by forming an oval or rectangular shape via, such that the ratio of the minor axis of the oval to the line with or the ratio of the width of the rectangle to the line width is less than about 0.7.

Growing community of inventors

Sunnyvale, CA, United States of America

Kok-Yong Yiang